公开(公告)号：US09961769B2

公开(公告)日：2018-05-01

申请号：US14162002

申请日：2014-01-23

Applicant: Intel Corporation

Inventor： Md Altaf Hossain ,  Cliff C. Lee ,  David W. Browning ,  Itai M. Pines ,  Brian P. Kelly

IPC: H05K1/11 ,  H01L23/498 ,  H01L23/00 ,  H05K3/34

CPC classification number: H05K1/111 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/12042 ,  H05K1/112 ,  H05K3/3436 ,  H05K2201/09972 ,  H05K2201/10378 ,  H01L2924/014 ,  H01L2924/00

Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.