公开(公告)号：US10925152B2

公开(公告)日：2021-02-16

申请号：US16146168

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Albert Sutono ,  Xiaoning Ye ,  Jimmy Hsu ,  Daniel Hull

IPC: H05K1/02 ,  H05K3/34 ,  H01L23/00 ,  H01L23/538 ,  H01L23/498 ,  H05K3/28

Abstract: Apparatuses, systems and methods associated with dielectric coatings for printed circuit boards are disclosed herein. In embodiments, a printed circuit board (PCB) includes a substrate, microstrip conductors located on a surface of the substrate, a solder mask covering the surface of the substrate and the microstrip conductors, and a dielectric coating located on the solder mask, the dielectric coating on an opposite side of the solder mask from the microstrip conductors, wherein a thickness of the dielectric coating is selected to cause a ratio of capacitive coupling to self capacitance to be approximately equal to a ratio of inductive coupling to self inductance for each microstrip conductor of the microstrip conductors, where the thickness may be determined based on a specific methodology including simulations. Other embodiments may be described and/or claimed.

公开(公告)号：US20190045623A1

公开(公告)日：2019-02-07

申请号：US16146168

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Albert Sutono ,  Xiaoning Ye ,  Jimmy Hsu ,  Daniel Hull

IPC: H05K1/02 ,  H05K3/34 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: Apparatuses, systems and methods associated with dielectric coatings for printed circuit boards are disclosed herein. In embodiments, a printed circuit board (PCB) includes a substrate, microstrip conductors located on a surface of the substrate, a solder mask covering the surface of the substrate and the microstrip conductors, and a dielectric coating located on the solder mask, the dielectric coating on an opposite side of the solder mask from the microstrip conductors, wherein a thickness of the dielectric coating is selected to cause a ratio of capacitive coupling to self capacitance to be approximately equal to a ratio of inductive coupling to self inductance for each microstrip conductor of the microstrip conductors, where the thickness may be determined based on a specific methodology including simulations. Other embodiments may be described and/or claimed.