Patent search ap:("Intel Corporation") AND inv:"Derek A. THOMPSON" Page 1

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发明申请
MEMORY MODULE DESIGNED TO CONFORM TO A FIRST MEMORY CHIP SPECIFICATION HAVING MEMORY CHIPS DESIGNED TO CONFORM TO A SECOND MEMORY CHIP SPECIFICATION 审中-公开

公开(公告)号：US20190042095A1

公开(公告)日：2019-02-07

申请号：US16111156

申请日：2018-08-23

Applicant: Intel Corporation

Inventor： George VERGIS , Bill NALE , Derek A. THOMPSON , James A. McCALL , Rajat AGARWAL , Wei P. CHEN

IPC: G06F3/06

Abstract: An apparatus is described. The apparatus includes a memory controller having register space to inform the memory controller that the memory controller is coupled to a memory module that conforms to a first memory chip industry standard specification but is composed of memory chips that conform to a second, different memory chip industry standard specification.

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