公开(公告)号：US20190223324A1

公开(公告)日：2019-07-18

申请号：US16368341

申请日：2019-03-28

Applicant: Intel Corporation

Inventor： Minh Le ,  Thomas Boyd ,  Bijoyraj Sahu ,  Evan Chenelly ,  Christopher Wade Ackerman ,  Carlos Alvizo Flores ,  Craig Jahne

IPC: H05K7/20

CPC classification number: H05K7/20281 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20409 ,  H05K7/20509 ,  H05K7/20781 ,  H05K7/20836

Abstract: Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

公开(公告)号：US11032941B2

公开(公告)日：2021-06-08

申请号：US16368341

申请日：2019-03-28

Applicant: Intel Corporation

Inventor： Minh Le ,  Thomas Boyd ,  Bijoyraj Sahu ,  Evan Chenelly ,  Christopher Wade Ackerman ,  Carlos Alvizo Flores ,  Craig Jahne

IPC: H05K7/20

Abstract: Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

公开(公告)号：US10595439B2

公开(公告)日：2020-03-17

申请号：US16017731

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： David Shia ,  Evan Chenelly ,  Mohanraj Prabhugoud

IPC: H05K7/20 ,  F28D15/02 ,  H05K1/18 ,  H05K1/02 ,  G06F1/20 ,  H01L23/427 ,  F28F1/30 ,  H01L23/467 ,  H01L23/367

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.

公开(公告)号：US20190045663A1

公开(公告)日：2019-02-07

申请号：US16017731

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： David Shia ,  Evan Chenelly ,  Mohanraj Prabhugoud

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  H05K1/18 ,  H05K1/02

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.