公开(公告)号：US09288933B2

公开(公告)日：2016-03-15

申请号：US14142821

申请日：2013-12-28

Applicant: Intel Corporation

Inventor： Gavin D. Stanley ,  Michael T. Crocker

IPC: H01L23/34 ,  H05K7/20 ,  H01L23/373 ,  H01L23/473 ,  F28F13/00

CPC classification number: H05K7/2039 ,  F28F13/00 ,  H01L23/34 ,  H01L23/3733 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.

Abstract translation: 提供散热装置。 散热装置包括集成散热器和联接到集成散热器的底板，其中基板包括多个金属颗粒以散热来自集成散热器的热量。