公开(公告)号：US20220338344A1

公开(公告)日：2022-10-20

申请号：US17855680

申请日：2022-06-30

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Gordon Melz ,  Daqiao Du ,  Ismael Franco ,  Jason Mix

IPC: H05K1/02 ,  H05K1/11

Abstract: Methods and apparatus relating to phase heterogeneous interconnects for crosstalk reduction are described. In one embodiment, an interconnect includes a plurality of links. A first set of links from the plurality of links communicates signals and a second set of links from the plurality of links provides a return path. The interconnect also includes one or more links from the first set of links that include one or more structures with a larger diameter than a minimum diameter of the one or more links. The larger diameter modifies an inductance or capacitance of the one or more links to provide a heterogenous phase delay amongst the plurality of links. Other embodiments are also claimed and disclosed.