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    REFLOW COMPATIBLE OPTICAL PACKAGING
    5.
    发明申请
    REFLOW COMPATIBLE OPTICAL PACKAGING 审中-公开

    公开(公告)号：US20190121036A1

    公开(公告)日：2019-04-25

    申请号：US16225248

    申请日：2018-12-19

    Applicant: Intel Corporation

    Inventor： John Heck ,  Hari Mahalingam ,  Paul Yu ,  Kumar Satya Harinadh Potluri

    IPC: G02B6/42

    Abstract: In various embodiments, optical fibers may be placed into V-shaped grooves in a substrate. A lid may then be placed on top of the optical fibers to hold them accurately in place, and the lid may be attached to the substrate using a reflow solder technique. Epoxy may then be applied as a strain relief. Because the V-shaped grooves and optical waveguides are manufactured with precision on the same substrate, precise alignment between these two may be achieved. Because the epoxy is applied after reflow, the epoxy may not be exposed to reflow temperatures, which might otherwise cause the epoxy to distort during the cure process.

    Contactless optical probing of edge-coupled photonic ICs
    7.
    发明授权
    Contactless optical probing of edge-coupled photonic ICs 有权

    公开(公告)号：US12216158B2

    公开(公告)日：2025-02-04

    申请号：US17102891

    申请日：2020-11-24

    Applicant: Intel Corporation

    Inventor： Jeremy Hicks ,  Hari Mahalingam ,  Christopher Seibert ,  Eric Snow ,  Harel Frish

    IPC: G01R31/311 ,  G02B6/30 ,  G02B6/42

    Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.

    OPTICAL DEVICE INCLUDING BURIED OPTICAL WAVEGUIDES AND OUTPUT COUPLERS
    9.
    发明申请
    OPTICAL DEVICE INCLUDING BURIED OPTICAL WAVEGUIDES AND OUTPUT COUPLERS 审中-公开

    公开(公告)号：US20190339466A1

    公开(公告)日：2019-11-07

    申请号：US16517159

    申请日：2019-07-19

    Applicant: Intel Corporation

    Inventor： John Heck ,  Harel Frish ,  Reece DeFrees ,  George A. Ghiurcan ,  Hari Mahalingam ,  Pegah Seddighian

    IPC: G02B6/42

    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler including an optical waveguide to guide light to an optical fiber. In embodiments, the optical waveguide includes a tapered segment to propagate the received light to the optical fiber. In embodiments, the tapered segment is buried below a surface of a semiconductor substrate to transition the received light within the semiconductor substrate from a first optical mode to a second optical mode to reduce a loss of light during propagation of the received light from the optical waveguide to the optical fiber. In embodiments, the surface of the semiconductor substrate comprises a bottom planar surface of a silicon photonic chip that includes at least one or more of passive or active photonic components. Other embodiments may be described and/or claimed.

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