公开(公告)号：US20230260788A1

公开(公告)日：2023-08-17

申请号：US17671101

申请日：2022-02-14

Applicant: Intel Corporation

Inventor： Huy Cao ,  Hong Li ,  Jian Jiao ,  Xiandong Yang ,  Honore Djieutedjeu ,  Jean Claude Chokomakoua ,  Ram Raju ,  Bharat Krishnan

IPC: H01L21/033 ,  C01B21/082

CPC classification number: H01L21/0332 ,  H01L21/0337 ,  C01B21/082 ,  H01L27/2481

Abstract: An embodiment of an apparatus may include a substrate and a semiconductor structure disposed on the substrate, where the semiconductor structure comprises a plurality of layers of material and where at least one layer of the plurality of layers of material comprises carbon-nitride-carbon (CNC). Other embodiments are disclosed and claimed.