公开(公告)号：US20210167019A1

公开(公告)日：2021-06-03

申请号：US16636315

申请日：2017-09-01

Applicant: Intel Corporation

Inventor： Daniel Zierath ,  Srijit Mukherjee ,  Jason Farmer ,  Chandan Ganpule ,  Julia Lin

IPC: H01L23/532 ,  H01L21/768

Abstract: Provided herein are metal interconnects that may include a cobalt alloy, a nickel alloy, or nickel. Also provided herein are methods of making metal interconnects. The metal interconnects may include a barrier and/or adhesion layer, a seed layer, a fill material, a cap, or a combination thereof, and at least one of the barrier and/or adhesion layer, the seed layer, the fill material, or the cap may include a cobalt alloy, a nickel alloy, nickel, or a combination thereof.