公开(公告)号：US10157822B1

公开(公告)日：2018-12-18

申请号：US15721691

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Tae Young Yang ,  Guosong Lin ,  Ling Zheng ,  Daqiao Du

IPC: H01L23/498 ,  H01L23/60 ,  H01L23/522

Abstract: Electrical interconnects having a non-linear conductive pathway, and related apparatuses and methods, are disclosed herein. In some embodiments, an electrical interconnect may include a non-linear conductive pathway electrically coupling top and bottom conductive portions. In some embodiments, an electrical interconnect may include a non-linear conductive pathway that propagates an electrical signal generating electromagnetic fields with an electrical field orthogonal to the direction of electromagnetic-wave propagation. In some embodiments, an electrical interconnect may include a non-linear conductive pathway portion and a linear conductive pathway portion. Also disclosed are connectors including an electrical interconnect having a non-linear conductive pathway. In some embodiments, a connector may include a first electrical interconnect having a non-linear conductive pathway generating first electromagnetic fields; and second electrical interconnect having a linear conductive pathway generating second electromagnetic fields that are orthogonal to the first electromagnetic fields.

公开(公告)号：US10950536B2

公开(公告)日：2021-03-16

申请号：US16017710

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Jun Liao ,  Xiang Li ,  Kevin Stone ,  Daqiao Du ,  Tae-Young Yang ,  Ling Zheng ,  James A. McCall

IPC: H01L23/498 ,  H01R12/71 ,  H01R43/20 ,  H01R43/16 ,  H01R12/57 ,  H01R12/52 ,  H01R13/6467 ,  H01R12/70

Abstract: An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.