公开(公告)号：US20240012769A1

公开(公告)日：2024-01-11

申请号：US18370621

申请日：2023-09-20

Applicant: Intel Corporation

Inventor： Francesc GUIM BERNAT ,  Manish DAVE ,  Vered BAR BRACHA ,  Bradley A. BURRES ,  Uzair QURESHI ,  Joseph GRECCO ,  Paul KAPPLER ,  Dirk F. BLEVINS ,  Mukesh Gangadhar BHAVANI VENKATESAN ,  Hariharan M ,  Marek PIOTROWSKI ,  Dhanya PILLAI ,  John MANGAN ,  Mandar CHINCHOLKAR ,  Eoin WALSH ,  Sumit MOHAN ,  Ned SMITH ,  Tushar Sudhakar GOHAD

IPC: G06F13/16 ,  G06F11/20

CPC classification number: G06F13/1668 ,  G06F11/2017 ,  G06F2201/80

Abstract: Examples described herein relate to a network interface device. In some examples, the network interface device includes a network interface, a direct memory access (DMA) circuitry, a host interface, memory, one or more processors, and circuitry to: based on a configuration of operation specifying a standalone operation, cause the network interface device to operate in standalone to execute one or more applications and based on a configuration of operation specifying a companion operation, cause the network interface device to operate in companion to provide at least one host system with access to one or more hardware resources accessible by the network interface device.

公开(公告)号：US20240134726A1

公开(公告)日：2024-04-25

申请号：US18537703

申请日：2023-12-12

Applicant: Intel Corporation

Inventor： Akhilesh S. THYAGATURU ,  Francesc GUIM BERNAT ,  Karthik KUMAR ,  Adrian HOBAN ,  Marek PIOTROWSKI

IPC: G06F9/54 ,  G06F1/20

CPC classification number: G06F9/548 ,  G06F1/206

Abstract: A method is described. The method includes invoking one of more functions from a set of API functions that expose the current respective cooling states of different, respective cooling devices for different components of a hardware platform. The method includes orchestrating concurrent execution of multiple applications on the hardware platform in view of the current respective cooling states. The method includes, in order to prepare the hardware platform for the concurrent execution of the multiple applications, prior to the concurrent execution of the multiple applications, sending one or more commands to the hardware platform to change a cooling state of at least one of the cooling devices.

公开(公告)号：US20240134432A1

公开(公告)日：2024-04-25

申请号：US18537697

申请日：2023-12-12

Applicant: Intel Corporation

Inventor： Akhilesh S. THYAGATURU ,  Francesc GUIM BERNAT ,  Karthik KUMAR ,  Jonathan KYLE ,  Marek PIOTROWSKI

IPC: G06F1/20 ,  G06F9/455

CPC classification number: G06F1/206 ,  G06F9/45558 ,  G06F2009/45591

Abstract: A method is claimed. The method includes receiving information associated with a software application's workflow. The method includes receiving information that describes a platform's current power consumption state and current thermal state. The method includes selecting platform components to support execution of the workflow. The method includes prior to execution of the workflow upon the selected platform components, estimating a thermal impact to the platform's current thermal state as a consequence of the workflow's execution upon the selected platform components. The method includes determining a change to be made to a thermal cooling system of the platform in response to the estimating and causing the change to be made to the thermal cooling system prior to execution of at least a portion of the workflow on the platform.