公开(公告)号：US20230180434A1

公开(公告)日：2023-06-08

申请号：US17542907

申请日：2021-12-06

Applicant: Intel Corporation

Inventor： David Shia ,  Jin Yang ,  Jimmy Chuang ,  Mohanraj Prabjugoud ,  Michael T. Crocker

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20381

Abstract: A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device includes at least one surface and at least one projection extending from the at least one surface, wherein the at least one projection includes at least one sidewall, and wherein the at least one sidewall of the at least one projection includes at least one surface area enhancement structure. Utilizing such a heat dissipation device can boost nucleate boiling, improve boiling performance, reduce superheat required to initiate boiling, boost the critical heat flux during boiling, and can translate to a greater number of integrated circuit devices/packages that can be placed into a single immersion cooling system.