公开(公告)号：US20220100247A1

公开(公告)日：2022-03-31

申请号：US17033753

申请日：2020-09-26

Applicant: Intel Corporation

Inventor： Vivek Garg ,  Ankush Varma ,  Krishnakanth Sistla ,  Nikhil Gupta ,  Nikethan Shivanand Baligar ,  Stephen Wang ,  Nilanjan Palit ,  Timothy Kam ,  Adwait Purandare ,  Ujjwal Gupta ,  Stanley Chen ,  Dorit Shapira ,  Shruthi Venugopal ,  Suresh Chemudupati ,  Rupal Parikh ,  Eric Dehaemer ,  Pavithra Sampath ,  Phani Kumar Kandula ,  Yogesh Bansal ,  Dean Mulla ,  Michael Tulanowski ,  Stephen Haake ,  Andrew Herdrich ,  Ripan Das

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.

公开(公告)号：US12298833B2

公开(公告)日：2025-05-13

申请号：US18007627

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Ujjwal Gupta ,  Ankush Varma ,  Lakshmipriya Seshan ,  Nikethan Shivanand Baligar ,  Nikhil Gupta ,  Swadesh Choudhary ,  Yogesh Bansal

IPC: G06F1/324 ,  G06F1/10 ,  G06F1/3203 ,  G06F11/34 ,  G06F13/00 ,  G06F15/16

Abstract: A single communication fabric for a data processing apparatus is provided. The fabric has an interconnection network to provide a topology of data communication channels between a plurality of data-handling functional units. The interconnection network has a first interconnection domain to provide data communication between a first subset of the data-handling functional units and a second interconnection domain to provide data communication between a second subset of the data-handling functional units. The power management circuitry is arranged to control a first performance level for the first interconnection domain independently from control of a second performance level for the second interconnection domain. Machine readable instructions and a method are provided to concurrently set performance levels of two different fabric domains to respective different operating frequencies.

公开(公告)号：US12093100B2

公开(公告)日：2024-09-17

申请号：US17033753

申请日：2020-09-26

Applicant: Intel Corporation

Inventor： Vivek Garg ,  Ankush Varma ,  Krishnakanth Sistla ,  Nikhil Gupta ,  Nikethan Shivanand Baligar ,  Stephen Wang ,  Nilanjan Palit ,  Timothy Yee-Kwong Kam ,  Adwait Purandare ,  Ujjwal Gupta ,  Stanley Chen ,  Dorit Shapira ,  Shruthi Venugopal ,  Suresh Chemudupati ,  Rupal Parikh ,  Eric Dehaemer ,  Pavithra Sampath ,  Phani Kumar Kandula ,  Yogesh Bansal ,  Dean Mulla ,  Michael Tulanowski ,  Stephen Paul Haake ,  Andrew Herdrich ,  Ripan Das ,  Nazar Syed Haider ,  Aman Sewani

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

CPC classification number: G06F1/28 ,  G06F1/30 ,  G06F13/20 ,  G06F2213/40

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.