公开(公告)号：US20230092740A1

公开(公告)日：2023-03-23

申请号：US17481257

申请日：2021-09-21

Applicant: Intel Corporation

Inventor： Srinivas V. PIETAMBARAM ,  Rahul N. MANEPALLI ,  Ravindra TANIKELLA

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/538 ,  H01L21/48 ,  H01L23/00

Abstract: Embodiments disclosed herein include electronic packages and methods of assembling such electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a hole is through a thickness of the core, and a plug fills the hole, where the plug comprises a polymeric material. In an embodiment, first layers are over the core, where the first layers comprise a dielectric material; and second layers are under the core, where the second layers comprise the dielectric material.

公开(公告)号：US20230088392A1

公开(公告)日：2023-03-23

申请号：US17481258

申请日：2021-09-21

Applicant: Intel Corporation

Inventor： Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Rahul N. MANEPALLI ,  Ravindra TANIKELLA ,  Sameer PAITAL

IPC: H01L23/498 ,  H01L23/15 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48

Abstract: Embodiments disclosed herein include electronic packages and methods of assembling such electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a first via is through the core, where the first via directly contacts the core. In an embodiment, a second via is through the core, and a sleeve is around the second via. In an embodiment, the sleeve comprises a material with a thermal conductivity that is greater than a thermal conductivity of the second via.

公开(公告)号：US20230087838A1

公开(公告)日：2023-03-23

申请号：US17479033

申请日：2021-09-20

Applicant: Intel Corporation

Inventor： Rahul N. MANEPALLI ,  Srinivas V. PIETAMBARAM ,  Ravindra TANIKELLA ,  Sameer PAITAL ,  Gang DUAN

IPC: H01L23/29 ,  C03C17/32

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed to a protective coating for an edge of a glass layer, in particular a glass core within a substrate of a package, where the protective coating serves to protect the edge of the glass core and fill in cracks at the edges of the glass. This protective coating will decrease cracking during stresses applied to the glass layer during manufacturing or operation. Other embodiments may be described and/or claimed.