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公开(公告)号:US20210263100A1
公开(公告)日:2021-08-26
申请号:US17240877
申请日:2021-04-26
Applicant: Intel Corporation
Inventor: Amit Agarwal , Ram Krishnamurthy , Satish Damaraju , Steven Hsu , Simeon Realov
IPC: G01R31/317 , G01R31/3177 , H03K3/037 , G01R31/3185
Abstract: An apparatus is provided which comprises: a multi-bit quad latch with an internally coupled level sensitive scan circuitry; and a combinational logic coupled to an output of the multi-bit quad latch. Another apparatus is provided which comprises: a plurality of sequential logic circuitries; and a clocking circuitry comprising inverters, wherein the clocking circuitry is shared by the plurality of sequential logic circuitries.
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公开(公告)号:US11009549B2
公开(公告)日:2021-05-18
申请号:US16681691
申请日:2019-11-12
Applicant: Intel Corporation
Inventor: Amit Agarwal , Ram Krishnamurthy , Satish Damaraju , Steven Hsu , Simeon Realov
IPC: G01R31/317 , G01R31/3177 , H03K3/037 , G01R31/3185
Abstract: An apparatus is provided which comprises: a multi-bit quad latch with an internally coupled level sensitive scan circuitry; and a combinational logic coupled to an output of the multi-bit quad latch. Another apparatus is provided which comprises: a plurality of sequential logic circuitries; and a clocking circuitry comprising inverters, wherein the clocking circuitry is shared by the plurality of sequential logic circuitries.
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公开(公告)号:US11442103B2
公开(公告)日:2022-09-13
申请号:US17240877
申请日:2021-04-26
Applicant: Intel Corporation
Inventor: Amit Agarwal , Ram Krishnamurthy , Satish Damaraju , Steven Hsu , Simeon Realov
IPC: G01R31/317 , G01R31/3177 , H03K3/037 , G01R31/3185
Abstract: An apparatus is provided which comprises: a multi-bit quad latch with an internally coupled level sensitive scan circuitry; and a combinational logic coupled to an output of the multi-bit quad latch. Another apparatus is provided which comprises: a plurality of sequential logic circuitries; and a clocking circuitry comprising inverters, wherein the clocking circuitry is shared by the plurality of sequential logic circuitries.
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公开(公告)号:US20190187208A1
公开(公告)日:2019-06-20
申请号:US15846047
申请日:2017-12-18
Applicant: Intel Corporation
Inventor: Amit Agarwal , Ram Krishnamurthy , Satish Damaraju , Steven Hsu , Simeon Realov
IPC: G01R31/317 , H03K3/037 , G01R31/3177
Abstract: An apparatus is provided which comprises: a multi-bit quad latch with an internally coupled level sensitive scan circuitry; and a combinational logic coupled to an output of the multi-bit quad latch. Another apparatus is provided which comprises: a plurality of sequential logic circuitries; and a clocking circuitry comprising inverters, wherein the clocking circuitry is shared by the plurality of sequential logic circuitries.
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公开(公告)号:US20230387074A1
公开(公告)日:2023-11-30
申请号:US17825350
申请日:2022-05-26
Applicant: Intel Corporation
Inventor: Debendra Mallik , Nitin Deshpande , Satish Damaraju , Scott Siers , Kai-Chiang Wu
IPC: H01L25/065 , H01L23/498 , H01L23/31 , H01L23/538 , H01L23/00
CPC classification number: H01L25/0652 , H01L23/49816 , H01L23/3128 , H01L23/5385 , H01L24/16 , H01L2224/16146 , H01L2224/16227 , H01L2225/06513
Abstract: An integrated circuit assembly may be formed having a first level structure that comprises a monolithic substrate with a first reticle zone including integrated circuitry and a second reticle zone including integrated circuitry, and a second level structure comprising at least one integrated circuit device electrically attached to the integrated circuitry of the first reticle zone of the first level structure and a bridge electrically attaching the integrated circuitry of the first reticle zone of the first level structure and the integrated circuitry of the second reticle zone of the first level structure.
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公开(公告)号:US20230305978A1
公开(公告)日:2023-09-28
申请号:US17702271
申请日:2022-03-23
Applicant: Intel Corporation
Inventor: Mark C. Davis , Hong Jiang , Satish Damaraju
IPC: G06F13/40
CPC classification number: G06F13/4022 , G06F13/4009 , G06F13/4068
Abstract: Described herein is a modular parallel processor comprising an active base die including hardware logic, interconnect logic, and a plurality of chiplet slots and a plurality of chiplets vertically stacked on the active base die and coupled with the plurality of chiplet slots of the active base die. The plurality of chiplets is interchangeable during assembly of the modular parallel processor and include a group of hardware logic chiplets having a plurality of different functional units and a group of memory chiplets having a plurality of different memory devices. The hardware logic chiplets and the memory chiplets interconnect via the interconnect logic within the active base die.
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7.
公开(公告)号:US20230205094A1
公开(公告)日:2023-06-29
申请号:US17561524
申请日:2021-12-23
Applicant: Intel Corporation
Inventor: Scott Siers , Satish Damaraju , Christopher Pelto
IPC: G03F7/20 , H01L23/48 , H01L23/498
CPC classification number: G03F7/70475 , H01L23/481 , H01L23/49816
Abstract: Compute complexes, base dies, and methods related to leveraging reticle stitching for improved device interconnects are discussed. A base die includes first and second regions having device layers, lower level metallization layers, and through vias fabricated using the same reticles. In the first region, a first subset of the through vias are contacted by higher metallization layers and, in the second region, a second distinct subset of the through vias are contacted by higher metallization layers such that the first and second metallization layers provide unique routing through vias having shared layouts and relative locations in the first and second regions.
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8.
公开(公告)号:US20210281250A1
公开(公告)日:2021-09-09
申请号:US16813558
申请日:2020-03-09
Applicant: Intel Corporation
Inventor: Steven Hsu , Amit Agarwal , Simeon Realov , Satish Damaraju , Ram Krishnamurthy
IPC: H03K3/037 , G06F3/06 , G01R31/3177 , G06F1/06
Abstract: A new family of shared clock single-edge triggered flip-flops that reduces a number of internal clock devices from 8 to 6 devices to reduce clock power. The static pass-gate master-slave flip-flop has no performance penalty compared to the flip-flops with 8 clock devices thus enabling significant power reduction. The flip-flop intelligently maintains the same polarity between the master and slave stages which enables the sharing of the master tristate and slave state feedback clock devices without risk of charge sharing across all combinations of clock and data toggling. Because of this, the state of the flip-flop remains undisturbed, and is robust across charge sharing noise. A multi-bit time borrowing internal stitched flip-flop is also described, which enables internal stitching of scan in a high performance time-borrowing flip-flop without incurring increase in layout area.
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公开(公告)号:US20200150179A1
公开(公告)日:2020-05-14
申请号:US16681691
申请日:2019-11-12
Applicant: Intel Corporation
Inventor: Amit Agarwal , Ram Krishnamurthy , Satish Damaraju , Steven Hsu , Simeon Realov
IPC: G01R31/317 , G01R31/3185 , H03K3/037 , G01R31/3177
Abstract: An apparatus is provided which comprises: a multi-bit quad latch with an internally coupled level sensitive scan circuitry; and a combinational logic coupled to an output of the multi-bit quad latch. Another apparatus is provided which comprises: a plurality of sequential logic circuitries; and a clocking circuitry comprising inverters, wherein the clocking circuitry is shared by the plurality of sequential logic circuitries.
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公开(公告)号:US10473718B2
公开(公告)日:2019-11-12
申请号:US15846047
申请日:2017-12-18
Applicant: Intel Corporation
Inventor: Amit Agarwal , Ram Krishnamurthy , Satish Damaraju , Steven Hsu , Simeon Realov
IPC: G01R31/317 , G01R31/3177 , H03K3/037 , G01R31/3185
Abstract: An apparatus is provided which comprises: a multi-bit quad latch with an internally coupled level sensitive scan circuitry; and a combinational logic coupled to an output of the multi-bit quad latch. Another apparatus is provided which comprises: a plurality of sequential logic circuitries; and a clocking circuitry comprising inverters, wherein the clocking circuitry is shared by the plurality of sequential logic circuitries.
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