公开(公告)号：US20230187850A1

公开(公告)日：2023-06-15

申请号：US17549427

申请日：2021-12-13

Applicant: Intel Corporation

Inventor： Ziyin Lin ,  Aaron Michael Garelick ,  Karumbu Meyyappan ,  Gregorio Murtagian ,  Srikant Nekkanty ,  Taylor Rawlings ,  Jeffory L. Smalley ,  Pooya Tadayon ,  Dingying Xu

IPC: H01R3/08 ,  H01L23/498 ,  H01L23/32 ,  H01R43/00

CPC classification number: H01R3/08 ,  H01L23/49816 ,  H01L23/32 ,  H01L23/49833 ,  H01R43/005

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a socket that includes one or more liquid metal filled reservoirs. In selected examples, the electronic devices and sockets include configurations to aid in reducing ingress of moisture.