公开(公告)号：US10122420B2

公开(公告)日：2018-11-06

申请号：US14979185

申请日：2015-12-22

Applicant: Intel IP Corporation

Inventor： Thorsten Meyer ,  Andreas Augustin ,  Reinhard Golly ,  Peter Baumgartner

IPC: H04B5/00 ,  H01L23/522 ,  H01L23/528 ,  H01L25/065

Abstract: Apparatus and methods are provided for wireless communications between integrated circuits or integrated circuit dies of an electronic system. In an example, an apparatus can include a first integrated circuit die including a plurality of integrated circuit devices, a second integrated circuit die including a second plurality of integrated circuit devices, and a conductor device configured to wirelessly receive a signal from the first integrated circuit die, to conduct the signal from a first end of an electrical conductor of the conductor device to a second end of the electrical conductor, and to wirelessly transmit the signal to the second integrated circuit die from the second end of the electrical conductor.