公开(公告)号：US11664328B2

公开(公告)日：2023-05-30

申请号：US17488067

申请日：2021-09-28

Applicant: Intel IP Corporation

Inventor： Rizwan Fazil

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/10

CPC classification number: H01L23/552 ,  H01L23/10 ,  H01L23/562 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: An integrated circuit package shield comprising a frame comprising two or more segments, the segments to interlock with one another along a substrate and the segments comprising electrically conductive material to electrically couple to the substrate; and a lid to cover the frame, the lid comprising a conductive material to electrically couple to the substrate.

公开(公告)号：US20210320071A1

公开(公告)日：2021-10-14

申请号：US15937246

申请日：2018-03-27

Applicant: Intel IP Corporation

Inventor： Rizwan Fazil

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/48

Abstract: An integrated circuit package shield comprising a frame comprising two or more segments, the segments to interlock with one another along a substrate and the segments comprising electrically conductive material to electrically couple to the substrate; and a lid to cover the frame, the lid comprising a conductive material to electrically couple to the substrate.

公开(公告)号：US20220013473A1

公开(公告)日：2022-01-13

申请号：US17488067

申请日：2021-09-28

Applicant: Intel IP Corporation

Inventor： Rizwan Fazil

IPC: H01L23/552 ,  H01L23/10 ,  H01L23/00

Abstract: An integrated circuit package shield comprising a frame comprising two or more segments, the segments to interlock with one another along a substrate and the segments comprising electrically conductive material to electrically couple to the substrate; and a lid to cover the frame, the lid comprising a conductive material to electrically couple to the substrate.

公开(公告)号：US11158585B1

公开(公告)日：2021-10-26

申请号：US15937246

申请日：2018-03-27

Applicant: Intel IP Corporation

Inventor： Rizwan Fazil

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/10

Abstract: An integrated circuit package shield comprising a frame comprising two or more segments, the segments to interlock with one another along a substrate and the segments comprising electrically conductive material to electrically couple to the substrate; and a lid to cover the frame, the lid comprising a conductive material to electrically couple to the substrate.