公开(公告)号：US20190088098A1

公开(公告)日：2019-03-21

申请号：US16190209

申请日：2018-11-14

Applicant: InvenSense, Inc.

Inventor： Vamshi GANGUMALLA ,  Sankalp DAYAL ,  Calin MICLAUS ,  Karthik KATINGARI ,  Rob DICK ,  Paul SCHREIER

IPC: G08B13/20 ,  G01L13/06 ,  G01L27/00 ,  G01L19/12 ,  G01L19/02 ,  G08B13/08

CPC classification number: G08B13/20 ,  G01L13/06 ,  G01L19/02 ,  G01L19/12 ,  G01L27/005 ,  G01P13/00 ,  G08B13/08 ,  G08B29/24

Abstract: A security system for a building comprises a pressure sensor and a computer system communicatively coupled with the pressure system. The pressure sensor coupled to a movable portion of a window in the building. The computer system is configured to: receive a first pressure measurement from the pressure sensor; compare the first pressure measurement to a reference pressure measurement; and based on the comparison, detect that the movable portion of the window has moved.

公开(公告)号：US20190150316A1

公开(公告)日：2019-05-16

申请号：US16246296

申请日：2019-01-11

Applicant: InvenSense, Inc.

Inventor： Sankalp DAYAL ,  Vamshi GANGUMALLA ,  Zaryab HAMAVAND ,  Calin MICLAUS

IPC: H05K7/20 ,  G01F1/88 ,  G06F1/3296 ,  G06F1/3228 ,  H05K7/14

Abstract: A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.

公开(公告)号：US20190124795A1

公开(公告)日：2019-04-25

申请号：US16104868

申请日：2018-08-17

Applicant: InvenSense, Inc.

Inventor： Sankalp DAYAL ,  Vamshi GANGUMALLA ,  Zaryab HAMAVAND ,  Calin MICLAUS

IPC: H05K7/20 ,  G01F1/34

Abstract: A circuit board cooling system comprises a circuit board, a processor disposed on the circuit board, a cooling unit operating according to an operating configuration to generate air flow to cool a portion of the circuit board, a plurality of pressure sensors configured to measure air pressure data at their respective locations, and a sensor processing unit coupled with the plurality of pressure sensors. The plurality of pressure sensors comprises a first pressure sensor located between the processor and the cooling unit and a second pressure sensor located such that the processor is between the second pressure sensor and the cooling unit. The sensor processing unit: obtains the air pressure data measured by the plurality of pressure sensors; compares the obtained air pressure data to reference air pressure data for the operating configuration; and based on the comparison, determines that a disturbance to the air flow exists.