公开(公告)号：US09355997B2

公开(公告)日：2016-05-31

申请号：US14288064

申请日：2014-05-27

Applicant: Invensas Corporation

Inventor： Rajesh Katkar ,  Laura Wills Mirkarimi ,  Arkalgud Sitaram ,  Charles G. Woychik

IPC: H01L25/065 ,  H01L23/367 ,  H01L21/66 ,  H01L21/78 ,  H01L23/10 ,  H01L23/14 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/04 ,  H01L21/784 ,  H01L25/18

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L21/78 ,  H01L21/784 ,  H01L22/32 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16176 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/167 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

Abstract translation: 包含集成电路并附接到布线基板（120）的模块（110,1310）的组件由附接到布线基板的一个或多个加强框架（410）加强。 模块位于加强框架中的开口（例如空腔和/或通孔414）中。 还提供其他功能。

公开(公告)号：US20150327367A1

公开(公告)日：2015-11-12

申请号：US14275741

申请日：2014-05-12

Applicant: Invensas Corporation

Inventor： Hong SHEN ,  Zhuowen Sun ,  Charles G. Woychik ,  Arkalgud Sitaram

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/49833 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/538 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/1615 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/141 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A combined interposer (120) includes multiple constituent interposers (120.i), each with its own substrate (120.iS) and with a circuit layer (e.g. redistribution layer) on top and/or bottom of the substrate. The top circuit layers can be part of a common circuit layer (120R.T) which can interconnect different interposers. Likewise, the bottom circuit layers can be part of a common circuit layer (120R.B). The constituent interposer substrates (120.iS) are initially part of a common wafer, and the common top circuit layer is fabricated before separation of the constituent interposer substrates from the wafer. Use of separated substrates reduces stress compared to use of a single large substrate. Other features are also provided.

Abstract translation: 组合插入器（120）包括多个成分插入件（120.i），每个具有其自己的衬底（120.iS）并且在衬底的顶部和/或底部上具有电路层（例如再分配层）。 顶层电路层可以是可以互连不同插入件的公共电路层（120R.T）的一部分。 类似地，底部电路层可​​以是公共电路层（120R.B）的一部分。 成分插入器基板（120.iS）最初是公共晶片的一部分，并且在将成分插入器基板与晶片分离之前制造公共顶层电路层。 与使用单个大型基材相比，分离的基材的使用降低了应力。 还提供其他功能。

公开(公告)号：US09905507B2

公开(公告)日：2018-02-27

申请号：US15181872

申请日：2016-06-14

Applicant: Invensas Corporation

Inventor： Hong Shen ,  Zhuowen Sun ,  Charles G. Woychik ,  Arkalgud Sitaram

IPC: H01L21/768 ,  H01L23/498 ,  H05K1/11 ,  H01L25/00 ,  H05K1/18 ,  H05K1/02 ,  H05K1/14 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/683 ,  H01L25/03 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49833 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/538 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/1615 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/141 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A combined interposer (120) includes multiple constituent interposers (120.i), each with its own substrate (120.iS) and with a circuit layer (e.g. redistribution layer) on top and/or bottom of the substrate. The top circuit layers can be part of a common circuit layer (120R.T) which can interconnect different interposers. Likewise, the bottom circuit layers can be part of a common circuit layer (120R.B). The constituent interposer substrates (120.iS) are initially part of a common wafer, and the common top circuit layer is fabricated before separation of the constituent interposer substrates from the wafer. Use of separated substrates reduces stress compared to use of a single large substrate. Other features are also provided.

公开(公告)号：US20160293534A1

公开(公告)日：2016-10-06

申请号：US15181872

申请日：2016-06-14

Applicant: Invensas Corporation

Inventor： Hong SHEN ,  Zhuowen Sun ,  Charles G. Woychik ,  Arkalgud Sitaram

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/49833 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/538 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/1615 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/141 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A combined interposer (120) includes multiple constituent interposers (120.i), each with its own substrate (120.iS) and with a circuit layer (e.g. redistribution layer) on top and/or bottom of the substrate. The top circuit layers can be part of a common circuit layer (120R.T) which can interconnect different interposers. Likewise, the bottom circuit layers can be part of a common circuit layer (120R.B). The constituent interposer substrates (120.iS) are initially part of a common wafer, and the common top circuit layer is fabricated before separation of the constituent interposer substrates from the wafer. Use of separated substrates reduces stress compared to use of a single large substrate. Other features are also provided.

公开(公告)号：US09402312B2

公开(公告)日：2016-07-26

申请号：US14275741

申请日：2014-05-12

Applicant: Invensas Corporation

Inventor： Hong Shen ,  Zhuowen Sun ,  Charles G. Woychik ,  Arkalgud Sitaram

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/498 ,  H05K1/11 ,  H01L25/00 ,  H05K1/18 ,  H05K1/02 ,  H05K1/14

CPC classification number: H01L23/49833 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/538 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/1615 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/141 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A combined interposer (120) includes multiple constituent interposers (120.i), each with its own substrate (120.iS) and with a circuit layer (e.g. redistribution layer) on top and/or bottom of the substrate. The top circuit layers can be part of a common circuit layer (120R.T) which can interconnect different interposers. Likewise, the bottom circuit layers can be part of a common circuit layer (120R.B). The constituent interposer substrates (120.iS) are initially part of a common wafer, and the common top circuit layer is fabricated before separation of the constituent interposer substrates from the wafer. Use of separated substrates reduces stress compared to use of a single large substrate. Other features are also provided.

Abstract translation: 组合插入器（120）包括多个成分插入件（120.i），每个具有其自己的衬底（120.iS）并且在衬底的顶部和/或底部上具有电路层（例如再分配层）。 顶层电路层可以是可以互连不同插入件的公共电路层（120R.T）的一部分。 类似地，底部电路层可​​以是公共电路层（120R.B）的一部分。 成分插入器基板（120.iS）最初是公共晶片的一部分，并且在将成分插入器基板与晶片分离之前制造公共顶层电路层。 与使用单个大型基材相比，分离的基材的使用降低了应力。 还提供其他功能。