公开(公告)号：US20160262268A1

公开(公告)日：2016-09-08

申请号：US14639789

申请日：2015-03-05

Applicant: Invensas Corporation

Inventor： Reynaldo CO ,  Grant VILLAVICENCIO ,  Wael ZOHNI

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  B29C45/14

CPC classification number: H05K3/103 ,  B29C45/14065 ,  B29C45/14221 ,  B29C45/14655 ,  B29C45/14754 ,  B29C2045/1477 ,  B29L2031/3425 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0296 ,  H05K3/0014 ,  H05K2201/10757 ,  H05K2201/10818 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

Abstract translation: 在形成微电子器件的方法中，将基底装载到模压机中。 基板具有第一表面和第二表面。 第二表面放置在模压机的内下表面上。 衬底具有从第一表面延伸到模压机的内部上表面的多个引线接合线。 模具膜的上表面被分配到模压机的内部上表面。 模具薄膜的下表面被多根线接合线的尖端刺穿，使得多个线接合线的顶端在模具薄膜的下表面上延伸到模制薄膜中。 多个线接合线的尖端朝向模制薄膜的下表面压下以使尖端弯曲。