公开(公告)号：US08951845B2

公开(公告)日：2015-02-10

申请号：US14163145

申请日：2014-01-24

Applicant: Invensas Corporation

Inventor： Kazuo Sakuma ,  Ilyas Mohammed ,  Philip Damberg

IPC: H01L21/44

CPC classification number: H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14136 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/3303 ,  H01L2224/33051 ,  H01L2224/331 ,  H01L2224/33505 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/8185 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of fabricating a microelectronic package can include mounting a microelectronic element to a substrate with a joining material. The mounting can include bonding a front surface of the microelectronic element to a first surface of the substrate with a joining material, and joining contacts arranged within a contact-bearing region of the front surface of the microelectronic element with corresponding substrate contacts at the substrate first surface, the joining creating electrical contact between the microelectronic element and the substrate. The method can also include forming an underfill between the substrate first surface and the contact-bearing region of the front surface of the microelectronic element, the underfill reinforcing the joints between the contacts and the substrate contacts, the joining material having a Young's modulus less than 75% of a Young's modulus of the underfill.

Abstract translation: 制造微电子封装的方法可以包括使用接合材料将微电子元件安装到衬底上。 安装件可以包括用接合材料将微电子元件的前表面接合到基板的第一表面，以及将布置在微电子元件的前表面的接触区域内的接触件与在基板处的相应的基板触点接合 表面，该接合在微电子元件和衬底之间产生电接触。 该方法还可以包括在基板第一表面和微电子元件的前表面的接触区之间形成底部填充物，底部填充物增强了触点和基板触点之间的接合，该接合材料的杨氏模量小于 底部填充物的杨氏模量的75％。

公开(公告)号：US20140141568A1

公开(公告)日：2014-05-22

申请号：US14163145

申请日：2014-01-24

Applicant: Invensas Corporation

Inventor： Kazuo Sakuma ,  Ilyas Mohammed ,  Philip Damberg

IPC: H01L21/56

CPC classification number: H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14136 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/3303 ,  H01L2224/33051 ,  H01L2224/331 ,  H01L2224/33505 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/8185 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic package can include a substrate having a first surface and a plurality of substrate contacts at the first surface and a microelectronic element having a front surface and contacts arranged within a contact-bearing region of the front surface. The contacts of the microelectronic element can face the substrate contacts and can be joined thereto. An underfill can be disposed between the substrate first surface and the contact-bearing region of the front surface of the microelectronic element. The underfill can reinforce the joints between the contacts and the substrate contacts. A joining material can bond the substrate first surface with the front surface of the microelectronic element. The joining material can have a Young's modulus less than 75% of a Young's modulus of the underfill.

Abstract translation: 微电子封装可以包括在第一表面具有第一表面和多个基板触点的基板和具有前表面的微电子元件和布置在前表面的接触区域内的触点。 微电子元件的触点可以面对基板触点并且可以与其接合。 可以在基板第一表面和微电子元件的前表面的接触区域之间设置底部填充物。 底部填充物可以加强触点和基板触点之间的接合。 接合材料可以将基板第一表面与微电子元件的前表面接合。 接合材料的杨氏模量可以小于底部填充物的杨氏模量的75％。