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公开(公告)号：US20240405427A1
公开(公告)日：2024-12-05
申请号：US18694811
申请日：2022-09-16
Applicant: JABIL INC.
Inventor： Ian Jeffery Timmins , Babak Zarrin Rafie , Youssef Faltone , John Finnell
Abstract: A mmWave antenna that has particular application to be used in a 5G radio. The antenna includes a thick copper power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin copper power layer formed on a side of second prepreg layer opposite to the signal layer. Microvias extend through the first prepreg layer that electrically couple the thick copper layer to the signal layer and microvias extend through the second prepreg layer that electrically couple the thin copper layer to the signal layer, where the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer.
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公开(公告)号：US20240413530A1
公开(公告)日：2024-12-12
申请号：US18694733
申请日：2022-09-16
Applicant: JABIL INC.
Inventor： Ian Jeffery Timmins , Babak Zarrin Rafie , Youssef Faltone , John Finnell
Abstract: A mmWave antenna that has particular application to be used in a 5G radio. The antenna includes a RGB structure having a plurality of layers. The RGB structure includes a first via hole formed into the layers through one side of the RGB structure and filled with a first via and a second via hole formed into the layers through an opposite side of the RGB structure and filled with a second via, where the first and second vias are electrically coupled by an interconnect. Prepreg buildup layers are formed on the one side of the PCB structure and prepreg buildup layers are formed on the opposite side of the PCB structure. A beamforming IC is formed on the prepreg buildup layers on the one side of the PCB structure and an antenna radiating element is formed on the prepreg buildup layers on the opposite side of the PCB structure.
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公开(公告)号：US20240405435A1
公开(公告)日：2024-12-05
申请号：US18694779
申请日：2022-09-16
Applicant: JABIL INC.
Inventor： Ian Jeffery Timmins , Babak Zarrin Rafie , Youssef Faltone , John Finnell
Abstract: A mmWave phased array antenna that has particular application to be used in a 5G radio. The antenna includes a PCB structure having a plurality of dielectric layers and conductive layers. A beamforming IC is formed on one side of the PCB structure and a patch antenna radiating element is formed at an opposite side of the PCB structure from the beamforming IC, where one of the dielectric layers is formed over the radiating element so that the radiating element is buried.
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公开(公告)号：US20240388000A1
公开(公告)日：2024-11-21
申请号：US18694775
申请日：2022-09-16
Applicant: JABIL INC.
Inventor： Ian Jeffery Timmins , Babak Zarrin Rafie , Youssef Faltone , John Finnell
Abstract: A mmWave phased array antenna that has particular application to be used in a 5G radio. The antenna includes a RGB structure having a plurality of prepreg buildup layers including microvias on one side and on an opposite side. A plurality of beamforming ICs are formed on the prepreg buildup layers on the one side of the RGB structure and a plurality of horn antenna radiating element are formed on the prepreg buildup layers on the opposite side of the RGB structure, where each of the horn antenna radiating elements includes a feed structure formed in one of the prepreg buildup layers and a horn aperture extending from the feed structure and formed in a metal layer.
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