公开(公告)号：US20240312861A1

公开(公告)日：2024-09-19

申请号：US18607298

申请日：2024-03-15

Applicant: JCET Group Co. Ltd.

Inventor： Chen XU ,  JianYong WU ,  Shuo LIU

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/367 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/92225

Abstract: Disclosed are a three-dimensional package structure and a method for forming the same. The method includes: flip-mounting the first die onto the first substrate; mounting the heat conductive plate onto the first substrate, such that bottom portions of the two vertical plates of the heat conductive plate are attached onto a surface of the first substrate and the lateral plate is attached onto a surface, away from the first substrate, of the first die; mounting the second substrate over the first substrate, such that top portions of the two vertical plates of the heat conductive plate are respectively embedded into the two openings; filling up a space between the first substrate and the second substrate with a molding layer; flip-mounting the second die onto a surface of the second substrate; and mounting the heat sink, such that the heat sink encircles an outer surface of the second die.

公开(公告)号：US20240413042A1

公开(公告)日：2024-12-12

申请号：US18736444

申请日：2024-06-06

Applicant: JCET Group Co., Ltd.

Inventor： Shuo LIU ,  Chen XU ,  JianYong WU

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/528

Abstract: A package structure and a method for forming the same are provided. The package structure includes: a first substrate having an upper surface and a lower surface that are opposite to each other, wherein at least one trench is defined in the first substrate, the trench extending through a portion of the upper surface of the first substrate; a first chip mounted onto the upper surface of the first substrate on a side of the trench, wherein the first chip electrically connects to the first substrate; a heat sink lid including a horizontal heat sink plate and a first vertical pin and at least one second vertical pin, wherein a length of the second vertical pin is greater than a length of the first vertical pin, and the heat sink lid is mounted onto the upper surface of the first substrate.