公开(公告)号：US20250062215A1

公开(公告)日：2025-02-20

申请号：US18800344

申请日：2024-08-12

Applicant: JCET Group Co., Ltd.

Inventor： Danfeng YANG ,  Yao LI ,  Lei LV ,  Songhua XU ,  Yaojian LIN

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/16

Abstract: The present disclosure relates to a package structure and a method for forming the same. The package structure includes: a first surface and a second surface that are opposite, passive devices mounted on the first surface of the substrate; a first molding layer encapsulating the passive devices and covering the first surface of the substrate; a first chip comprising a back face and a functional face that are opposite; metal connection structures each comprising a horizontal metal strip and a vertical metal pin electrically connected to the horizontal metal strip; a second molding layer encapsulating the metal connection structures and the first chip and covering the second surface of the substrate; and first solder bumps on the exposed top surfaces of the external terminals.