公开(公告)号：US20180105648A1

公开(公告)日：2018-04-19

申请号：US15567311

申请日：2016-04-11

Applicant: JFE CHEMICAL CORPORATION

Inventor： Youhei INOUE ,  Hiroaki MORI

IPC: C08G73/10

CPC classification number: C08G73/1067 ,  C08G73/1007 ,  C08G73/1042 ,  C08G73/1057

Abstract: A polyamide acid composition and a polyimide composition are obtained from a tetracarboxylic acid compound containing an aromatic tetracarboxylic acid compound having a naphthalene skeleton and a diamine compound containing an aromatic diamine compound having a biphenyl skeleton.

公开(公告)号：US20170044321A1

公开(公告)日：2017-02-16

申请号：US15306129

申请日：2015-04-20

Applicant: JFE CHEMICAL CORPORATION

Inventor： Youhei INOUE ,  Hiroaki MORI

IPC: C08G73/10

CPC classification number: C08G73/10 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2307/206 ,  B32B2307/734 ,  B32B2457/08 ,  C08G73/1042 ,  C08G73/1085 ,  C08L79/08 ,  C09J7/22 ,  C09J7/25 ,  C09J7/30 ,  C09J2203/326 ,  C09J2477/00 ,  C09J2479/086 ,  H05K1/0346 ,  H05K2201/0154

Abstract: There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride.

Abstract translation: 提供了可用于电子基板材料的聚酰亚胺组合物，保留了聚酰亚胺本身的高耐热性和机械强度，并且具有较低的介电常数和介电损耗角正切。 一种用于电子基板材料的聚酰亚胺组合物，其含有通过在含有5-（4-氨基苯氧基）-3- [4-（4-氨基苯氧基）苯基] -1,1,3-三甲基茚满的二胺成分和 含有3,3'，4,4'-联苯四羧酸二酐的酸组分。