公开(公告)号：US5986894A

公开(公告)日：1999-11-16

申请号：US045379

申请日：1998-03-19

Applicant: James D. Lint ,  Nanci Vogtli

Inventor： James D. Lint ,  Nanci Vogtli

IPC: H01F5/04 ,  H01F17/06 ,  H01F27/02 ,  H01F27/29 ,  H01F41/10 ,  H01L23/32 ,  H01R43/01 ,  H05K3/30 ,  H05K5/02 ,  H01F27/28 ,  H05K7/02

CPC classification number: H01F41/10 ,  H01F17/062 ,  H01F27/027 ,  H01L23/32 ,  H05K3/301 ,  H01F27/29 ,  H01F5/04 ,  H01L2924/0002

Abstract: A microelectronic component carrier package and method of its manufacture. A non-conducting component carrier having vertical risers and guide channels permits the rapid and accurate routing of microelectronic component leads with respect to the leadframe. Specially shaped perforations in the leadframe adjacent to and aligned with the guide channels receive the leads, strip away the necessary amount of insulation, and sever the leads to the proper length in one manufacturing process step. The leads are joined to the leadframe by an interference fit, conventional bonding technique (such as solder or thermal compression bonding), or other techniques. The perforations further provide for stress relief of the leads in the assembled package, and permit the joints between the leadframe and leads to reside outside of the package, thereby minimizing the overall volume of the package. The perforations may also be used as masks for laser energy used to strip insulation from the leads in the vicinity of the perforations.

Abstract translation: 一种微电子元件载体封装及其制造方法。 具有垂直立管和引导通道的非导电部件载体允许微电子元件引线相对于引线框的快速和准确的布线。 在引导框架中与引导通道相邻并与引导通道对准的特殊形状的穿孔接收引线，剥离必要量的绝缘体，并且在一个制造工艺步骤中将引线切断到合适的长度。 引线通过干涉配合，常规粘合技术（例如焊料或热压接）或其它技术连接到引线框架上。 这些穿孔进一步提供了组装好的包装中引线的应力消除，并且允许引线框架和引线之间的接合部位于封装的外部，从而最小化封装的总体积。 穿孔也可以用作用于从穿孔附近的引线剥离绝缘的激光能量的掩模。