公开(公告)号：US20240396290A1

公开(公告)日：2024-11-28

申请号：US18321501

申请日：2023-05-22

Applicant: Jin-Shown Shie ,  Precision Sensors Design Inc.

Inventor： Jin-Shown SHIE ,  Joseph Weng ,  Tsai-Sen Lin ,  Hsiang-Chih Meng ,  Shou-Jing Yu

IPC: H01S5/0225 ,  H01S5/02212 ,  H01S5/02345

Abstract: An IR emitter package includes a TO-can unit, a light emitting diode (LED), and an infrared (IR) emitting unit. The TO-can unit includes a header plateau that has top and bottom sides and a hole extending through top and bottom sides. A first connection pin extending through the hole has a top end exposed from a center region of the top side surrounding the hole. The second connection pin is electrically insulated from the first connection pin. The LED is disposed on the center region and directly electrically connects the top end of the first connection pin. The IR emitting unit includes a membrane above a cavity that is aligned with and encompasses the center region of the header plateau to receive the LED. The LED has a bonding pad, and a connecting wire connecting the bonding pad to an electrical connecting site within the cavity on the header plateau.