公开(公告)号：US20080264679A1

公开(公告)日：2008-10-30

申请号：US11720448

申请日：2004-11-30

Applicant: Johan Sandwall

Inventor： Johan Sandwall

IPC: H05K1/03

CPC classification number: H05K1/024 ,  H05K1/142 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0391 ,  H05K2201/09972 ,  H05K2203/061

Abstract: The invention discloses a PCB (100, 400) with first and second main surfaces (110, 130), the PCB also having a first height, h, said two surfaces and height together defining the volume of the PCB. The PCB comprises layers (430, 434, 438) of a first supporting laminate material, layers (440, 431, 433, 435, 437, 439) of a first conducting material and layers (432, 436) of a first prepreg, said first materials and prepreg having respective dielectrical constants and dissipation factors. In the PCB, a sub-volume of the PCB defined by a sub-area (120) within the first main surface and a sub-height (h′) within said first height together comprise a sub-PCB (320) which comprises at least one layer (330, 334) of a second supporting laminate material, said second laminate material differing from the first laminate material with regard to at least one of the factors dielectrical constant and dissipation factor.

Abstract translation: 本发明公开了一种具有第一和第二主表面（110,130）的PCB（100,400），PCB还具有第一高度h，所述两个表面和高度一起限定PCB的体积。 PCB包括第一支撑层叠材料的层（430,434,438），第一导电材料的层（440,431,433,435,437,439）和第一半固化片的层（432,436），所述层 第一材料和预浸料具有各自的介电常数和耗散因子。 在PCB中，由第一主表面内的子区域（120）限定的PCB的子体积和所述第一高度内的子高度（h'）一起包括子PCB（320），其包括在 至少一层（330,334）的第二支撑层压材料，所述第二层压材料与第一层压材料不同于至少一个因素介电常数和耗散因子。

公开(公告)号：US20080174969A1

公开(公告)日：2008-07-24

申请号：US11720449

申请日：2004-11-30

Applicant: Johan Sandwall

Inventor： Johan Sandwall

IPC: H05K7/20 ,  H05K3/00

CPC classification number: H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10416 ,  Y10T29/49124

Abstract: A multi-layer printed board assembly (PBA) with improved heat dissipation characteristics. An electronic component is surface mounted on a main surface at least partially over a cooling component arranged integrally in the PBA. The cooling component transports heat from the electronic component through the PBA in a first direction (x) essentially perpendicular to the main surface of the PBA, and in a second direction (y) essentially parallel to the main surface of the PBA.

Abstract translation: 具有改善散热特性的多层印刷电路板组件（PBA）。 至少部分地将电子部件表面安装在主表面上，整体地布置在PBA中的冷却部件上。 冷却组件沿着基本上垂直于PBA的主表面的第一方向（x）和基本上平行于PBA的主表面的第二方向（y）将热量从电子部件传送通过PBA。

公开(公告)号：US20080158821A1

公开(公告)日：2008-07-03

申请号：US11720403

申请日：2004-11-30

Applicant: Johan Sandwall

Inventor： Johan Sandwall

IPC: H05K7/20

CPC classification number: H05K1/0204 ,  H05K3/341 ,  H05K3/4611 ,  H05K2201/09309 ,  H05K2201/09845 ,  H05K2201/10416

Abstract: A multi-layer printed board assembly (PBA) with improved heat dissipation characteristics. The PBA includes a cooling component, which extends essentially perpendicularly through the layers of the PBA. A first end of the cooling component contacts a cooling structure external to the PBA. An electronic component is surface mounted at least partially over a second end of the cooling component. The cooling component transports heat from the electronic component through the PBA to the external cooling structure.

Abstract translation: 具有改善散热特性的多层印刷电路板组件（PBA）。 PBA包括基本垂直延伸穿过PBA层的冷却部件。 冷却部件的第一端接触PBA外部的冷却结构。 电子部件至少部分地表面安装在冷却部件的第二端上。 冷却组件将热量从电子部件通过PBA输送到外部冷却结构。