公开(公告)号：US07413934B2

公开(公告)日：2008-08-19

申请号：US11774914

申请日：2007-07-09

Applicant: John P Tellkamp

Inventor： John P Tellkamp

IPC: H01L21/44

CPC classification number: H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/12868 ,  Y10T428/12875 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (302) and a plurality of lead segments (303). Covering the base metal are, consecutively, a continuous nickel layer (201) on the base metal, a layer of palladium on the nickel, wherein the palladium layer (203) on the chip side of the structure is thicker than the palladium layer (202) opposite the chip, and a gold layer (204) on the palladium layer (202) opposite the chip. A semiconductor chip (310) is attached to the chip mount pad and conductive connections (312) span from the chip to the lead segments. Polymeric encapsulation compound (320) covers the chip, the connections, and portions of the lead segments, but leaves other segment portions available for solder reflow attachment to external parts.

Abstract translation: 半导体器件具有由基底金属（105）制成的结构的引线框架，其中该结构由芯片安装焊盘（302）和多个引线段（303）组成。 在基体金属上连续地覆盖基体金属的连续的镍层（201），镍上的钯层，其中结构的芯片侧的钯层（203）比钯层（202 ）和与芯片相对的钯层（202）上的金层（204）。 半导体芯片（310）附接到芯片安装焊盘，导电连接（312）跨越芯片到引线段。 聚合物封装化合物（320）覆盖芯片，连接部分和引线段的部分，但留下其他段部分可用于焊接回流附着到外部部件。

公开(公告)号：US08378506B2

公开(公告)日：2013-02-19

申请号：US13117853

申请日：2011-05-27

Applicant: James C Wainerdi ,  John P Tellkamp

Inventor： James C Wainerdi ,  John P Tellkamp

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29366 ,  H01L2224/29384 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A method of assembling an electronic device and electronic packages therefrom. A die attach adhesive precursor is placed between a top surface of a workpiece and an IC die. The die attach adhesive precursor includes metal particles, a first plurality of first microcapsules having a polymerizable material inside, and a second plurality of second microcapsules having a polymerization agent inside to form a first polymer upon rupture of first and second microcapsules. A force sufficient to rupture at least a portion of the first plurality of first microcapsules and at least a portion of the second plurality of second microcapsules is applied to form a self-healing die attach adhesive wherein the first polymer binds the plurality of metal particles and the remaining microcapsules and secures the IC die to the top surface of the workpiece. The self-healing die attach adhesive generally includes at least 90 vol. % metal.

Abstract translation: 一种从其组装电子装置和电子包装件的方法。 将芯片附着粘合剂前体放置在工件的顶表面和IC芯片之间。 芯片附着粘合剂前体包括金属颗粒，具有内部具有可聚合材料的第一多个第一微胶囊和在第一和第二微胶囊破裂时内部具有聚合剂以形成第一聚合物的第二多个第二微胶囊。 施加足以使至少一部分第一多个第一微胶囊和至少一部分第二多个第二微胶囊破裂的力以形成自修复模片附着粘合剂，其中第一聚合物结合多个金属颗粒和 剩余的微胶囊并将IC芯片固定到工件的顶部表面。 自修复贴片粘合剂通常包括至少90体积％ ％金属。

公开(公告)号：US07550852B2

公开(公告)日：2009-06-23

申请号：US11470541

申请日：2006-09-06

Applicant: John P Tellkamp ,  Akira Matsunami

Inventor： John P Tellkamp ,  Akira Matsunami

IPC: H01L23/48

CPC classification number: B23K35/262 ,  B23K35/286 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/325 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01083

Abstract: An integrated circuit chip which has a plurality of pads and non-reflowable contact members to be connected by reflow attachment to external parts. Each of these contact members has a height-to-diameter ratio and uniform diameter favorable for absorbing strain under thermo-mechanical stress. The members have a solderable surface on each end and a layer of reflowable material on each end. Each member is solder-attached at one end to a chip contact pad, while the other end of each member is operable for reflow attachment to external parts.

Abstract translation: 一种集成电路芯片，其具有多个焊盘和不可回流接触部件，以通过回流附接到外部部件来连接。 这些接触构件中的每一个具有高度 - 直径比和均匀的直径，其有利于在热机械应力下吸收应变。 这些构件在每一端具有可焊接表面，并且在每一端具有一层可回流材料。 每个构件的一端被焊接附接到芯片接触垫，而每个构件的另一端可操作用于回流附接到外部部件。

公开(公告)号：US08129227B2

公开(公告)日：2012-03-06

申请号：US12885654

申请日：2010-09-20

Applicant: John P Tellkamp

Inventor： John P Tellkamp

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L21/4842 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10848 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A packaged surface-mount semiconductor device has the outer, un-encapsulated lead segments structured in five adjoining portions: The first portion protrudes from the encapsulation about horizontally; the second portion forms a convex bend downwardly; the third portion is approximately straight downwardly; the fourth portion forms a concave bend upwardly; and the fifth portion is straight horizontally. Each segment has across the width a first groove in the third portion, either on the bottom surface or on the top surface. Preferably, the groove is about 2 leadframe thicknesses vertically over the bottom surface of the fifth lead portion. When stamped, the groove may have an angular outline about 5 and 50 μm deep; when etched, the groove may have an approximately semicircular outline about 50 to 125 μm deep. A second groove may be located in the second segment portion; a third groove may be located in the transition region from the third to the fourth segment portions.

Abstract translation: 封装的表面贴装半导体器件具有构造在五个相邻部分中的外部未封装引线段：第一部分围绕水平从封装突出; 第二部分向下形成凸起的弯曲部分; 第三部分大致直线向下; 第四部分向上形成凹弯; 第五部分是水平的。 每个段在宽度上具有第三部分中的第一凹槽，无论是在底表面上还是在顶表面上。 优选地，凹槽在垂直于第五引线部分的底表面上的约2个引线框厚度。 当冲压时，凹槽可以具有约5和50μm深的角轮廓; 当蚀刻时，凹槽可以具有约50至125μm深的近似半圆形轮廓。 第二槽可以位于第二段部分中; 第三凹槽可以位于从第三分段部分到第四分段部分的过渡区域中。