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公开(公告)号:US09373815B2
公开(公告)日:2016-06-21
申请号:US14426931
申请日:2013-09-05
Applicant: Kaneka Corporation
Inventor: Takahiro Washio , Kazuhiro Kubo , Motoi Sasaki , Hideo Yamagishi , Akira Nishikawa , Katsuhiko Hayashi
CPC classification number: H01L51/5253 , H01L51/5203 , H01L51/5246 , H05B33/10
Abstract: Provided is an organic EL device which can prevent invasion of moisture to an organic EL element. The organic EL device has an organic EL element in which a first electrode layer, a functional layer, and a second electrode layer are stacked in sequence on a transparent substrate having a planar expanse, and an inorganic sealing layer for sealing at least an emission area of the organic EL element. A soft adhesion layer is stacked directly onto the inorganic sealing layer with a planar expanse, and the soft adhesion layer is made of a resin, and has flexibility.
Abstract translation: 提供一种能够防止有机EL元件侵入水分的有机EL元件。 有机EL元件具有有机EL元件,其中第一电极层,功能层和第二电极层依次层叠在具有平面exp的透明基板上,以及无机密封层,用于至少密封发光区域 的有机EL元件。 软粘合层直接堆叠在无机密封层上,具有平面的平面,软粘合层由树脂制成,具有柔软性。
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公开(公告)号:US20150228926A1
公开(公告)日:2015-08-13
申请号:US14426931
申请日:2013-09-05
Applicant: KANEKA CORPORATION
Inventor: Takahiro Washio , Kazuhiro Kubo , Motoi Sasaki , Hideo Yamagishi , Akira Nishikawa , Katsuhiko Hayashi
IPC: H01L51/52
CPC classification number: H01L51/5253 , H01L51/5203 , H01L51/5246 , H05B33/10
Abstract: Provided is an organic EL device which can prevent invasion of moisture to an organic EL element. The organic EL device has an organic EL element in which a first electrode layer, a functional layer, and a second electrode layer are stacked in sequence on a transparent substrate having a planar expanse, and an inorganic sealing layer for sealing at least an emission area of the organic EL element. A soft adhesion layer is stacked directly onto the inorganic sealing layer with a planar expanse, and the soft adhesion layer is made of a resin, and has flexibility.
Abstract translation: 提供一种能够防止有机EL元件侵入水分的有机EL元件。 有机EL元件具有有机EL元件,其中第一电极层,功能层和第二电极层依次层叠在具有平面exp的透明基板上,以及无机密封层,用于至少密封发光区域 的有机EL元件。 软粘合层直接堆叠在无机密封层上,具有平面的平面,软粘合层由树脂制成,具有柔软性。
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