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1.发明申请HIGH THERMAL CONDUCTIVITY THERMOPLASTIC RESIN COMPOSITION WITH EXCELLENT INJECTION MOLDABILITY 审中-公开高导热性热塑性树脂组合物，具有优异的注射成型性公开(公告)号：US20160152823A1
公开(公告)日：2016-06-02
申请号：US14900446
申请日：2014-07-01
Applicant: KANEKA CORPORATION
Inventor： Asato Nonomura , Soichi Uchida , Yasushi Noda
CPC classification number: C08L67/02 , B29C45/0001 , B29C45/0005 , B29C45/0013 , B29C45/14 , B29C45/14811 , B29K2067/003 , B29L2031/18 , C08K3/013 , C08K3/016 , C08K3/34 , C08K3/38 , C08K7/14 , C08L67/025 , C09K5/14 , H01L23/3737
Abstract: A highly thermally conductive thermoplastic resin composition of the present invention contains: (A) a thermoplastic polyester resin having a weight average molecular weight of 50,000 to 200,000; (B) a polyalkylene terephthalate block copolymer composed of a polyether segment and a polyethylene terephthalate segment which includes an ethylene terephthalate unit as a main component; and (C) a highly thermally conductive inorganic compound, the highly thermally conductive thermoplastic resin composition containing, with respect to 100 parts by weight of (A) the thermoplastic polyester resin, 20 parts by weight to 200 parts by weight of (B) the polyalkylene terephthalate block copolymer and 20 parts by weight to 250 parts by weight of (C) the highly thermally conductive inorganic compound.
Abstract translation: 本发明的高导热性热塑性树脂组合物含有：（A）重均分子量为50,000〜200,000的热塑性聚酯树脂; （B）由聚对苯二甲酸乙二醇酯单元作为主要成分的聚醚部分和聚对苯二甲酸乙二醇酯部分构成的聚对苯二甲酸亚烷基二醇酯嵌段共聚物; 和（C）高导热性无机化合物，高导热性热塑性树脂组合物相对于100重量份的（A）热塑性聚酯树脂，含有20重量份〜200重量份的（B） 聚对苯二甲酸亚烷基酯嵌段共聚物和20重量份至250重量份的（C）高导热性无机化合物。
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2.发明授权公开(公告)号：US10030138B2
公开(公告)日：2018-07-24
申请号：US14900446
申请日：2014-07-01
Applicant: Kaneka Corporation
Inventor： Asato Nonomura , Soichi Uchida , Yasushi Noda
Abstract: A highly thermally conductive thermoplastic resin composition of the present invention contains: (A) a thermoplastic polyester resin having a weight average molecular weight of 50,000 to 200,000; (B) a polyalkylene terephthalate block copolymer composed of a polyether segment and a polyethylene terephthalate segment which includes an ethylene terephthalate unit as a main component; and (C) a highly thermally conductive inorganic compound, the highly thermally conductive thermoplastic resin composition containing, with respect to 100 parts by weight of (A) the thermoplastic polyester resin, 20 parts by weight to 200 parts by weight of (B) the polyalkylene terephthalate block copolymer and 20 parts by weight to 250 parts by weight of (C) the highly thermally conductive inorganic compound.
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