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公开(公告)号：US10375836B2
公开(公告)日：2019-08-06
申请号：US15866547
申请日：2018-01-10
Applicant: KANEKA CORPORATION
Inventor： Takashi Kikuchi , Yasutaka Kondo
IPC: H05K3/38 , C09J7/25 , H05K3/14 , H05K3/06 , B32B15/08 , C08G73/10 , C09J179/08 , H05K1/03 , B32B7/12 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/28 , H05K3/18
Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.
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公开(公告)号：US09900994B2
公开(公告)日：2018-02-20
申请号：US15057934
申请日：2016-03-01
Applicant: KANEKA CORPORATION
Inventor： Takashi Kikuchi , Yasutaka Kondo
IPC: H05K3/38 , H05K3/18 , H05K3/06 , H05K3/14 , B32B15/08 , C08G73/10 , C09J7/02 , C09J179/08 , H05K1/03 , B32B7/12 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/28
CPC classification number: H05K3/386 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/281 , B32B2255/10 , B32B2255/205 , B32B2255/26 , B32B2307/306 , B32B2307/546 , B32B2307/704 , B32B2307/7265 , B32B2457/08 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C09J7/25 , C09J179/08 , C09J2201/622 , C09J2479/08 , C09J2479/086 , H05K1/0346 , H05K1/036 , H05K1/0393 , H05K3/06 , H05K3/146 , H05K3/18 , H05K2201/0129 , H05K2201/0154 , H05K2201/0355 , Y10T428/2896
Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.
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公开(公告)号：US20180132362A1
公开(公告)日：2018-05-10
申请号：US15866547
申请日：2018-01-10
Applicant: KANEKA CORPORATION
Inventor： Takashi Kikuchi , Yasutaka Kondo
CPC classification number: H05K3/386 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/281 , B32B2255/10 , B32B2255/205 , B32B2255/26 , B32B2307/306 , B32B2307/546 , B32B2307/704 , B32B2307/7265 , B32B2457/08 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C09J7/25 , C09J179/08 , C09J2201/622 , C09J2479/08 , C09J2479/086 , H05K1/0346 , H05K1/036 , H05K1/0393 , H05K3/06 , H05K3/146 , H05K3/18 , H05K2201/0129 , H05K2201/0154 , H05K2201/0355 , Y10T428/2896
Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.
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公开(公告)号：US20160183385A1
公开(公告)日：2016-06-23
申请号：US15057934
申请日：2016-03-01
Applicant: KANEKA CORPORATION
Inventor： Takashi KIKUCHI , Yasutaka Kondo
CPC classification number: H05K3/386 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/281 , B32B2255/10 , B32B2255/205 , B32B2255/26 , B32B2307/306 , B32B2307/546 , B32B2307/704 , B32B2307/7265 , B32B2457/08 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C09J7/25 , C09J179/08 , C09J2201/622 , C09J2479/08 , C09J2479/086 , H05K1/0346 , H05K1/036 , H05K1/0393 , H05K3/06 , H05K3/146 , H05K3/18 , H05K2201/0129 , H05K2201/0154 , H05K2201/0355 , Y10T428/2896
Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.
Abstract translation: 用该膜获得的薄膜和柔性覆金属层压板。 后吸湿可焊性提高了层压板。 该膜包括耐热聚酰亚胺膜，并且在其至少一个侧面上设置含有热塑性聚酰亚胺的粘合剂层。 其特征在于，粘合剂层中所含的热塑性聚酰亚胺具有结晶性，并且当用差示扫描量热计分析时，该膜具有归因于结晶性热塑性聚酰亚胺熔融的吸热峰，该面积的绝对值 峰值为4.0mJ / mg以上。 柔性覆金属层压板的特征在于包括膜和设置在其上的金属层。
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公开(公告)号：US10665362B2
公开(公告)日：2020-05-26
申请号：US15606508
申请日：2017-05-26
Applicant: KANEKA CORPORATION
Inventor： Yasutaka Kondo , Makoto Tawada , Kazuhiro Ono
IPC: B32B41/00 , H01B7/02 , H01B3/30 , B32B7/02 , H01B17/56 , H01B17/60 , B32B27/34 , H01B3/44 , B29C63/04 , G01N3/56 , H01B13/00 , H01B13/08 , B29L31/34
Abstract: An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k×b3 . . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in μm of the insulating film, and k is 0.000105 or more.
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Patent Agency Ranking
公开(公告)号：US20160075916A1
公开(公告)日：2016-03-17
申请号：US14954305
申请日：2015-11-30
Applicant: Kaneka Corporation
Inventor： Yasutaka Kondo , Makoto Tawada , Kazuhiro Ono
IPC: C09D179/08 , H01B13/06 , H01B3/44 , C09J7/02 , H01B3/30
CPC classification number: C09D179/08 , B32B7/02 , B32B27/08 , B32B27/281 , B32B27/30 , B32B27/304 , B32B27/322 , B32B2307/206 , B32B2307/51 , B32B2307/54 , B32B2307/554 , B32B2307/584 , B32B2605/18 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C09J7/25 , C09J2427/00 , H01B3/306 , H01B3/445 , H01B13/06
Abstract: An insulating coating material is provided herein. In some embodiments, the insulating coating material comprises an insulating film comprising a polyimide resin, wherein the insulating film, when measuring a tensile elasticity in accordance with ASTM D882, having a stress at 5% strain of 180 MPa or greater and a stress at 15% strain of 225 MPa or greater, wherein the stress at 15% strain is greater than the stress at 5% strain.
Abstract translation: 本文提供绝缘涂层材料。 在一些实施方案中，绝缘涂层材料包括包含聚酰亚胺树脂的绝缘膜，其中绝缘膜在测量根据ASTM D882的拉伸弹性时具有在5MPa应变为180MPa或更大的应力和15°处的应力 ％应变为225MPa以上，其中15％应变下的应力大于5％应变下的应力。
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公开(公告)号：US20210115192A1
公开(公告)日：2021-04-22
申请号：US17135809
申请日：2020-12-28
Applicant: KANEKA CORPORATION
Inventor： Takahiro Yasumoto , Dong Zhang , Hiroyuki Ushiro , Yasutaka Kondo , Kohei Ogawa , Masahiro Miyamoto
Abstract: A polyimide resin has an acid dianhydride-derived structure and a diamine-derived structure, the acid dianhydride contains an acid dianhydride represented by the general formula (1) and a fluorine-containing aromatic acid dianhydride, and the diamine contains a fluoroalkyl-substituted benzidine. In the general formula (1), n is an integer of 1 or more, and R1 to R4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or a perfluoroalkyl group having 1 to 20 carbon atoms. The content of the acid dianhydride represented by the general formula (1) may be 10 to 65 mol %, and the content of the fluorine-containing aromatic acid dianhydride may be 30 to 80 mol %, based on 100 mol % of the total of the acid dianhydride.
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公开(公告)号：US10745519B2
公开(公告)日：2020-08-18
申请号：US16091636
申请日：2017-04-07
Applicant: KANEKA CORPORATION
Inventor： Yasutaka Kondo , Hiroyuki Ushiro , Shoto Banya , Makoto Tawada
Abstract: A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300° C. or higher.
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公开(公告)号：US10703860B2
公开(公告)日：2020-07-07
申请号：US15606433
申请日：2017-05-26
Applicant: KANEKA CORPORATION
Inventor： Yasutaka Kondo , Makoto Tawada , Kazuhiro Ono
IPC: H01B7/02 , H01B3/44 , C09J7/25 , B32B27/32 , B32B27/08 , B32B27/28 , H01B17/56 , H01B3/30 , C08G73/10 , C08J5/18 , B32B15/18 , B32B15/085 , B32B27/30 , B32B15/20 , B32B15/082 , B32B27/34
Abstract: An insulating coating material including a polyimide film, and an adhesion layer on at least one side of a polyimide film. The polyimide film has a weight of 23.5 g or less per 1 m2 and a loop stiffness value of 0.45 g/cm or more.
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公开(公告)号：US10629328B2
公开(公告)日：2020-04-21
申请号：US15606508
申请日：2017-05-26
Applicant: KANEKA CORPORATION
Inventor： Yasutaka Kondo , Makoto Tawada , Kazuhiro Ono
IPC: B32B41/00 , H01B7/02 , H01B3/30 , B32B7/02 , H01B17/56 , H01B17/60 , B32B27/34 , H01B3/44 , B29C63/04 , G01N3/56 , H01B13/00 , H01B13/08 , B29L31/34
Abstract: An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k×b3 . . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in μm of the insulating film, and k is 0.000105 or more.
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