SMART PARKING MANAGEMENT SYSTEM WITH DECAL ELECTRONICS SYSTEM

    公开(公告)号:US20190385097A1

    公开(公告)日:2019-12-19

    申请号:US16074194

    申请日:2017-03-16

    Abstract: Various examples are related to parking management, including identifying and reserving empty parking spaces. In one example, a smart parking space system includes a parking controller located at a parking space. The parking controller can identify a vehicle located at the parking space via an input sensor or a transceiver that initiates wireless communication with an electronic tag associated with the vehicle; and communicate a parking vacancy associated with the parking space to a remote computing device based at least in part on the identification of the vehicle. In another example, a computing device can receive parking vacancy data associated with a parking space from a parking controller; determine a parking vacancy associated with the parking space using the parking vacancy data; and encode for display on a client device a network page that includes an indication of the parking vacancy associated with the parking space.

    VIRTUAL FAB AND LAB SYSTEM AND METHOD

    公开(公告)号:US20220163945A1

    公开(公告)日:2022-05-26

    申请号:US17602386

    申请日:2020-04-07

    Abstract: A system that connects a user to a cleanroom facility, the system including a computing device configured to receive a command from a user; and a platform remotely located from the computing device. The platform is configured to communicate with the computing device and with a cleanroom, the platform including a training module, an assessment module, and a manufacturing module. The platform is configured to, in response to receiving the command from the computing device, activate one of the training module, the assessment module, and the manufacturing module to take control over the cleanroom.

    ACTIVATABLE ELECTRONIC COMPONENT DESTRUCTION DEVICE

    公开(公告)号:US20190214350A1

    公开(公告)日:2019-07-11

    申请号:US16333357

    申请日:2017-09-26

    Abstract: An activable electronic component destruction device includes a heater and a heat-activated expandable material arranged on top of the heater. Heating of the heater causes the heat-activated expandable material to expand. The device further includes activation electronics coupled to the heater. The activation electronics are configured to control supply of power to the heater, which causes the heater to heat the heat-activated expandable material, which breaks a semiconductor substrate arranged on top of the heat-activated expandable material.

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