公开(公告)号：US20150041183A1

公开(公告)日：2015-02-12

申请号：US13960082

申请日：2013-08-06

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jun-Chung Hsu ,  Yu-Hui Wu ,  Huei-Cheng Hong

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/09 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/111 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/0338 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A chip board package structure includes a circuit board part, a chip board part and a solder used to solder the circuit board part and the chip board part. A chip on the chip board part is connected to an electrical circuit by wiring or soldering. A surface treatment metal layer includes at least nickel, palladium and gold formed on part of the surface of the circuit layer on the chip board. A copper-tin intermetallic compound is formed on joints of the second solder and the surface treatment metal layer, and the other part of the circuit layer is directly connected to the solder to form the copper-tin intermetallic compound. In addition to the lower package cost, with the shape feature of the copper-tin intermetallic compound, it is possible to increase the contact area with the solder, thereby improving the reliability of the soldering process and the yield.

Abstract translation: 芯片组封装结构包括电路板部分，芯片板部分和用于焊接电路板部分和芯片板部分的焊料。 芯片部分的芯片通过布线或焊接连接到电路。 表面处理金属层至少包括在芯片板上的电路层表面的一部分上形成的镍，钯和金。 在第二焊料和表面处理金属层的接合部上形成铜锡金属间化合物，电路层的另一部分与焊锡直接连接，形成铜锡金属间化合物。 除了较低的封装成本之外，通过铜 - 锡金属间化合物的形状特征，可以增加与焊料的接触面积，从而提高焊接工艺的可靠性和产率。