Systems and methods for scatterometric single-wavelength measurement of misregistration and amelioration thereof

    公开(公告)号:US11454894B2

    公开(公告)日:2022-09-27

    申请号:US17161604

    申请日:2021-01-28

    Abstract: A method and system for measuring misregistration between different layers of a semiconductor device, the method including providing a set of pupil inaccuracy scalable basis elements (PISBEs) relating to a plurality of patterned semiconductor device wafers (PSDWs), generating a single pupil image of a site on a PSDW, the PSDW being one of the plurality of PSDWs, by taking a single measurement of the site, the single pupil image including a plurality of site-specific pixels, calculating a set of site-specific pupil inaccuracy scalable basis element scaling factors (PISBESFs) for the single pupil image using the set of PISBEs and the plurality of site-specific pixels and calculating a site-specific misregistration value (SSMV) using the set of PISBEs and the set of site-specific PISBESFs.

    SYSTEMS AND METHODS FOR SCATTEROMETRIC SINGLE-WAVELENGTH MEASUREMENT OF MISREGISTRATION AND AMELIORATION THEREOF

    公开(公告)号:US20220082950A1

    公开(公告)日:2022-03-17

    申请号:US17161604

    申请日:2021-01-28

    Abstract: A method and system for measuring misregistration between different layers of a semiconductor device, the method including providing a set of pupil inaccuracy scalable basis elements (PISBEs) relating to a plurality of patterned semiconductor device wafers (PSDWs), generating a single pupil image of a site on a PSDW, the PSDW being one of the plurality of PSDWs, by taking a single measurement of the site, the single pupil image including a plurality of site-specific pixels, calculating a set of site-specific pupil inaccuracy scalable basis element scaling factors (PISBESFs) for the single pupil image using the set of PISBEs and the plurality of site-specific pixels and calculating a site-specific misregistration value (SSMV) using the set of PISBEs and the set of site-specific PISBESFs.

    SYSTEM AND METHOD FOR SUPPRESSION OF TOOL INDUCED SHIFT IN SCANNING OVERLAY METROLOGY

    公开(公告)号:US20240167813A1

    公开(公告)日:2024-05-23

    申请号:US18099798

    申请日:2023-01-20

    CPC classification number: G01B11/272 G01N21/4788 G01N21/956 G01B2210/56

    Abstract: An overlay metrology system and method are disclosed for generating an overlay measurement of an overlay target including cells with structures in reversed orders. The overlay metrology system may include an illumination sub-system and a collection sub-system. The collection sub-system may include one or more detectors to collect measurement light from a sample. The sample, according to a metrology recipe, may include an overlay target having a first cell of a first cell type and a second cell of a second cell type, where the second cell type includes structures in a reverse order relative to the first cell type. The metrology recipe may include receiving detection signals, generating an overlay measurement of each cell based on the detection signals, and generating an overlay measurement associated with the overlay target based on a value indicative of an average of the overlay measurements of each cell.

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