公开(公告)号：US20240360023A1

公开(公告)日：2024-10-31

申请号：US18594991

申请日：2024-03-04

Applicant: KLA Corporation

Inventor： Mandar Anand Paranjape

IPC: C03B29/16 ,  G02B7/00 ,  G03F7/00

CPC classification number: C03B29/16 ,  C03B2201/83 ,  G02B7/00 ,  G03F7/70833

Abstract: A method for binding a first optical element to a substrate is disclosed. The method may include receiving a first optical element and a substrate. The method may include positioning an indium foil between the first optical element and the substrate. The method may include securing the first optical element to the substrate to produce a pre-bonded assembly, wherein the indium foil is disposed between the first optical element and the substrate. The method may include heating the pre-bonded assembly above a melting temperature of the indium foil. The method may include cooling the pre-bonded assembly. The method may include releasing the pre-bonded assembly, wherein releasing the pre-bonded assembly releases a bonded structure.