公开(公告)号：US12131959B2

公开(公告)日：2024-10-29

申请号：US17469280

申请日：2021-09-08

Applicant: KLA Corporation

Inventor： Liran Yerushalmi ,  Daria Negri ,  Ohad Bachar ,  Yossi Simon ,  Amnon Manassen ,  Nir Ben David ,  Yoram Uziel ,  Etay Lavert

IPC: H01L21/66 ,  G05B19/418

CPC classification number: H01L22/12 ,  G05B19/41875 ,  G05B2219/45031

Abstract: A system and method for generating a quality parameter value of a semiconductor device wafer (SDW), during fabrication thereof, the method including designating a plurality of measurement site sets (MSSs) on the SDW, each of the MSSs including a first measurement-orientation site (FMS) and a second measurement-orientation site (SMS), the FMS and the SMS being different measurement sites on the SDW, generating a first measurement-orientation quality parameter dataset (FMQPD) by measuring features formed within each the FMS of at least one of the MSSs in a first measurement orientation, generating a second measurement-orientation quality parameter dataset (SMQPD) by measuring features formed within each the SMS of the at least one of the MSSs in a second measurement orientation and generating at least one tool-induced-shift (TIS)-ameliorated quality parameter value (TAQPV), at least partially based on the FMQPD and the SMQPD.

公开(公告)号：US20230068016A1

公开(公告)日：2023-03-02

申请号：US17446161

申请日：2021-08-26

Applicant: KLA Corporation

Inventor： Alexander Novikov ,  Amnon Manassen ,  Ido Dolev ,  Yuri Paskover ,  Nir Ben David ,  Yoel Feler ,  Yoram Uziel

IPC: H01L21/66 ,  G01D18/00 ,  G01B21/04

Abstract: A system and method for generating an angular calibration factor (ACF) for a metrology tool useful in a fabrication process, the method including providing the metrology tool, the metrology tool including a stage and a housing, measuring a rotational orientation of the stage relative to the housing and generating the ACF for the stage based at least partially on the rotational orientation.

公开(公告)号：US20220344218A1

公开(公告)日：2022-10-27

申请号：US17469280

申请日：2021-09-08

Applicant: KLA Corporation

Inventor： Liran Yerushalmi ,  Daria Negri ,  Ohad Bachar ,  Yossi Simon ,  Amnon Manassen ,  Nir Ben David ,  Yoram Uziel ,  Etay Lavert

IPC: H01L21/66 ,  G01N21/95

Abstract: A system and method for generating a quality parameter value of a semiconductor device wafer (SDW), during fabrication thereof, the method including designating a plurality of measurement site sets (MSSs) on the SDW, each of the MSSs including a first measurement-orientation site (FMS) and a second measurement-orientation site (SMS), the FMS and the SMS being different measurement sites on the SDW, generating a first measurement-orientation quality parameter dataset (FMQPD) by measuring features formed within each the FMS of at least one of the MSSs in a first measurement orientation, generating a second measurement-orientation quality parameter dataset (SMQPD) by measuring features formed within each the SMS of the at least one of the MSSs in a second measurement orientation and generating at least one tool-induced-shift (TIS)-ameliorated quality parameter value (TAQPV), at least partially based on the FMQPD and the SMQPD.