公开(公告)号：US20160061749A1

公开(公告)日：2016-03-03

申请号：US14674856

申请日：2015-03-31

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka

IPC: G01N21/95 ,  G01N21/94

CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/94 ,  G01N21/95 ,  G01N2201/061 ,  G01N2201/10

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括从通过用检查系统扫描晶片产生的帧图像为晶片上的晶片中的晶片的阵列区域的至少一部分生成测试图像。 该方法还包括从通过晶片扫描生成的帧图像生成阵列区域中的单元的参考图像。 另外，该方法包括通过从测试图像的一部分中减去参考图像来确定模具中的阵列区域的至少一部分中的至少一个单元的差分图像， 对应于至少一个小区。 该方法还包括基于差分图像来检测至少一个单元中的晶片上的缺陷。

公开(公告)号：US09766187B2

公开(公告)日：2017-09-19

申请号：US14838091

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka ,  Gangadharan Sivaraman ,  Raghav Babulnath ,  Satya Kurada ,  Shuo Sun

IPC: G01N21/95 ,  G01N21/956 ,  G01N21/00

CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/95 ,  G01N21/95607

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

公开(公告)号：US09766186B2

公开(公告)日：2017-09-19

申请号：US14674856

申请日：2015-03-31

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka

IPC: G01N21/95 ,  G01N21/00 ,  G01N21/94

CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/94 ,  G01N21/95 ,  G01N2201/061 ,  G01N2201/10

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

公开(公告)号：US20160061745A1

公开(公告)日：2016-03-03

申请号：US14838091

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Eugene Shifrin ,  Masatoshi Yamaoka ,  Gangadharan Sivaraman ,  Raghav Babulnath ,  Satya Kurada ,  Shuo Sun

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/00 ,  G01N21/95 ,  G01N21/95607

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system.The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括从通过用检查系统扫描晶片产生的帧图像为晶片上的晶片中的晶片的阵列区域的至少一部分生成测试图像。 该方法还包括从通过晶片扫描生成的帧图像生成阵列区域中的单元的参考图像。 此外，该方法包括通过从测试图像的一部分中减去参考图像来确定模具中的阵列区域的至少一部分中的至少一个单元的差分图像， 对应于至少一个小区。 该方法还包括基于差分图像来检测至少一个单元中的晶片上的缺陷。