公开(公告)号：US10571407B2

公开(公告)日：2020-02-25

申请号：US16400644

申请日：2019-05-01

Applicant: KLA-Tencor Corporation

Inventor： Stefano Palomba ,  Pavel Kolchin ,  Mikhail Haurylau ,  Robert M. Danen ,  David W. Shortt

IPC: G01N21/95 ,  G01N21/64 ,  G01N21/94

Abstract: Systems and methods for determining information for defects on a wafer are provided. One system includes an illumination subsystem configured to direct light having one or more illumination wavelengths to a wafer. The one or more illumination wavelengths are selected to cause fluorescence from one or more materials on the wafer without causing fluorescence from one or more other materials on the wafer. The system also includes a detection subsystem configured to detect only the fluorescence from the one or more materials or to detect non-fluorescent light from the wafer without detecting the fluorescence from the one or more materials. In addition, the system includes a computer subsystem configured to determine information for defects on the wafer using output generated by the detection subsystem responsive to the detected fluorescence or the detected non-fluorescent light.

公开(公告)号：US20140300890A1

公开(公告)日：2014-10-09

申请号：US14226745

申请日：2014-03-26

Applicant: KLA-Tencor Corporation

Inventor： Steven R. Lange ,  Robert M. Danen ,  Stefano Palomba

IPC: G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/1785

Abstract: Disclosed are methods and apparatus for inspecting a vertical semiconductor stack of a plurality of layers is disclosed. The method includes (a) on a confocal tool, repeatedly focusing an illumination beam at a plurality of focus planes at a plurality of different depths of a first vertical stack, wherein a defect is located at an unknown one of the different depths and the illumination beam has a wavelength range between about 700 nm and about 950 nm, (b) generating a plurality of in-focus images for the different depths based on in-focus output light detected from the first vertical stack at the different depths, wherein out-of-focus output light is inhibited from reaching the detector of the confocal system and inhibited from contributing to generation of the in-focus images, and (c) determining which one of the different depths at which the defect is located in the first vertical stack based on the in-focus images.

Abstract translation: 公开了用于检查多层的垂直半导体堆叠的方法和装置。 该方法包括（a）在共焦工具上，在第一垂直堆叠的多个不同深度的多个聚焦平面处重复聚焦照明光束，其中，缺陷位于不同深度的未知光和照明 光束具有约700nm至约950nm的波长范围，（b）基于在不同深度处从第一垂直堆叠检测到的聚焦输出光产生用于不同深度的多个对焦图像，其中， 聚焦输出光被抑制到达共焦系统的检测器并被抑制以有助于生成对焦图像，以及（c）确定缺陷位于第一垂直堆叠中的不同深度中的哪一个 基于对焦图像。

公开(公告)号：US20190257768A1

公开(公告)日：2019-08-22

申请号：US16400644

申请日：2019-05-01

Applicant: KLA-Tencor Corporation

Inventor： Stefano Palomba ,  Pavel Kolchin ,  Mikhail Haurylau ,  Robert M. Danen ,  David W. Shortt

IPC: G01N21/95 ,  G01N21/94 ,  G01N21/64

Abstract: Systems and methods for determining information for defects on a wafer are provided. One system includes an illumination subsystem configured to direct light having one or more illumination wavelengths to a wafer. The one or more illumination wavelengths are selected to cause fluorescence from one or more materials on the wafer without causing fluorescence from one or more other materials on the wafer. The system also includes a detection subsystem configured to detect only the fluorescence from the one or more materials or to detect non-fluorescent light from the wafer without detecting the fluorescence from the one or more materials. In addition, the system includes a computer subsystem configured to determine information for defects on the wafer using output generated by the detection subsystem responsive to the detected fluorescence or the detected non-fluorescent light.

公开(公告)号：US09696264B2

公开(公告)日：2017-07-04

申请号：US14226745

申请日：2014-03-26

Applicant: KLA-Tencor Corporation

Inventor： Steven R. Lange ,  Robert M. Danen ,  Stefano Palomba

IPC: G01N21/88 ,  G01N21/95 ,  G01N21/17

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/1785

Abstract: Disclosed are methods and apparatus for inspecting a vertical semiconductor stack of a plurality of layers is disclosed. The method includes (a) on a confocal tool, repeatedly focusing an illumination beam at a plurality of focus planes at a plurality of different depths of a first vertical stack, wherein a defect is located at an unknown one of the different depths and the illumination beam has a wavelength range between about 700 nm and about 950 nm, (b) generating a plurality of in-focus images for the different depths based on in-focus output light detected from the first vertical stack at the different depths, wherein out-of-focus output light is inhibited from reaching the detector of the confocal system and inhibited from contributing to generation of the in-focus images, and (c) determining which one of the different depths at which the defect is located in the first vertical stack based on the in-focus images.

公开(公告)号：US10317347B2

公开(公告)日：2019-06-11

申请号：US14511067

申请日：2014-10-09

Applicant: KLA-Tencor Corporation

Inventor： Stefano Palomba ,  Pavel Kolchin ,  Mikhail Haurylau ,  Robert M. Danen ,  David W. Shortt

IPC: G01N21/95 ,  G01N21/64 ,  G01N21/94

Abstract: Systems and methods for determining information for defects on a wafer are provided. One system includes an illumination subsystem configured to direct light having one or more illumination wavelengths to a wafer. The one or more illumination wavelengths are selected to cause fluorescence from one or more materials on the wafer without causing fluorescence from one or more other materials on the wafer. The system also includes a detection subsystem configured to detect only the fluorescence from the one or more materials or to detect non-fluorescent light from the wafer without detecting the fluorescence from the one or more materials. In addition, the system includes a computer subsystem configured to determine information for defects on the wafer using output generated by the detection subsystem responsive to the detected fluorescence or the detected non-fluorescent light.

公开(公告)号：US20150123014A1

公开(公告)日：2015-05-07

申请号：US14511067

申请日：2014-10-09

Applicant: KLA-Tencor Corporation

Inventor： Stefano Palomba ,  Pavel Kolchin ,  Mikhail Haurylau ,  Robert M. Danen ,  David W. Shortt

IPC: G01N21/95 ,  G01N21/94 ,  G01N21/64

CPC classification number: G01N21/9501 ,  G01N21/64 ,  G01N21/6489 ,  G01N21/94 ,  G01N2201/0612 ,  G01N2201/12

Abstract: Systems and methods for determining information for defects on a wafer are provided. One system includes an illumination subsystem configured to direct light having one or more illumination wavelengths to a wafer. The one or more illumination wavelengths are selected to cause fluorescence from one or more materials on the wafer without causing fluorescence from one or more other materials on the wafer. The system also includes a detection subsystem configured to detect only the fluorescence from the one or more materials or to detect non-fluorescent light from the wafer without detecting the fluorescence from the one or more materials. In addition, the system includes a computer subsystem configured to determine information for defects on the wafer using output generated by the detection subsystem responsive to the detected fluorescence or the detected non-fluorescent light.

Abstract translation: 提供了用于确定晶片上缺陷信息的系统和方法。 一个系统包括被配置为将具有一个或多个照明波长的光引导到晶片的照明子系统。 选择一个或多个照明波长以在晶片上产生来自一个或多个材料的荧光，而不引起来自晶片上的一种或多种其它材料的荧光。 该系统还包括检测子系统，该检测子系统被配置为仅检测来自该一种或多种材料的荧光，或者检测来自晶片的非荧光，而不检测来自该一种或多种材料的荧光。 另外，该系统包括计算机子系统，该计算机子系统被配置为使用响应于检测到的荧光或检测到的非荧光灯的检测子系统产生的输出来确定晶片上缺陷的信息。