METHOD OF INSPECTING FOREIGN SUBSTANCE ON SUBSTRATE
    1.
    发明申请
    METHOD OF INSPECTING FOREIGN SUBSTANCE ON SUBSTRATE 审中-公开
    检查基板上的外来物质的方法

    公开(公告)号:US20160025649A1

    公开(公告)日:2016-01-28

    申请号:US14781953

    申请日:2014-04-01

    Abstract: In order to inspect a substrate, an image information of a substrate before applying solder is displayed. Then, at least one inspection region on the substrate is image-captured to obtain an image of the inspection region that is image-captured. Then, image information that is to be displayed is renewed and the renewed image information is displayed. And, in order to inspect a foreign substance, obtained image of the inspection region is compared with a reference image of the substrate. Therefore, an operator can easily catch a region corresponding to a specific region of the image that is displayed, and easily detect a foreign substance on the substrate.

    Abstract translation: 为了检查基板,显示在施加焊料之前的基板的图像信息。 然后,对基板上的至少一个检查区域进行图像拍摄,以获得被图像捕获的检查区域的图像。 然后,更新要显示的图像信息,并显示更新的图像信息。 并且,为了检查异物,将获得的检查区域的图像与基板的参考图像进行比较。 因此,操作者可以容易地捕捉与所显示的图像的特定区域对应的区域,并容易地检测基板上的异物。

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