公开(公告)号：US11950374B2

公开(公告)日：2024-04-02

申请号：US17513412

申请日：2021-10-28

Applicant: KOH YOUNG TECHNOLOGY INC.

Inventor： Duk Young Lee ,  Jae Hyung Kim ,  Jeong Kyu Noh

IPC: H05K3/12 ,  B41F15/34 ,  H05K3/34 ,  B41F15/08

CPC classification number: H05K3/1225 ,  B41F15/34 ,  H05K3/3485 ,  B41F15/08

Abstract: An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.

公开(公告)号：US10674651B2

公开(公告)日：2020-06-02

申请号：US15852646

申请日：2017-12-22

Applicant: KOH YOUNG TECHNOLOGY INC.

Inventor： Jae Hyung Kim ,  Jeong Kyu Noh ,  Jae Hwan Lee ,  Duk Young Lee

IPC: G06K9/00 ,  H05K13/08 ,  B41F33/00 ,  G06T7/00 ,  B41F15/26 ,  G01B11/25 ,  G01N21/956 ,  G06K9/20 ,  H05K3/12 ,  H05K3/34

Abstract: A printed circuit board inspection apparatus generates at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtains at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determines a fault type associated with the at least one solder paste in which the anomaly is detected from at least one fault type, based on the obtained at least one value.

公开(公告)号：US11202372B2

公开(公告)日：2021-12-14

申请号：US16229453

申请日：2018-12-21

Applicant: KOH YOUNG TECHNOLOGY INC.

Inventor： Duk Young Lee ,  Jae Hyung Kim ,  Jeong Kyu Noh

IPC: H05K3/12 ,  B41F15/34 ,  H05K3/34 ,  B41F15/08

Abstract: An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.