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公开(公告)号:US20170137391A1
公开(公告)日:2017-05-18
申请号:US15322946
申请日:2015-06-30
Applicant: KOLON INDUSTRIES, INC.
Inventor: Hee Jin CHO , Do Kyung SUNG , Ki Hyun PARK , Sang Hun PARK , Hyun Soo KAGN
IPC: C07D265/14 , C08G61/12
CPC classification number: C07D265/14 , C08G61/122 , C08G2261/135 , C08G2261/1644 , C08G2261/60 , C08G2261/65 , C08G2261/76 , H05K1/0346 , H05K2201/012
Abstract: Disclosed is a polybenzoxazime precursor and a method of preparing the same. The polybenzoxazime precursor is used to prepare a hardened material having improved thermal characteristics, having high thermal and flame-retardant characteristics while maintaining its excellent electrical characteristics, or having high thermal and electrical characteristics, thus being available for use in a copper clad laminate, a semiconductor encapsulate, a printed circuit board, an adhesive, a paint, and a mold.
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公开(公告)号:US20170327476A1
公开(公告)日:2017-11-16
申请号:US15532576
申请日:2015-12-07
Applicant: KOLON INDUSTRIES, INC.
Inventor: Hee Jin CHO , Do Kyung SUNG , Ki Hyun PARK , Sang Hun PARK
IPC: C07D265/14 , C08G8/10 , C08G61/12 , C08K5/18
CPC classification number: C07D265/14 , C08G8/10 , C08G14/06 , C08G14/14 , C08G61/122 , C08G73/0233 , C08G2261/135 , C08G2261/148 , C08G2261/3326 , C08G2261/344 , C08G2261/592 , C08G2261/60 , C08G2261/65 , C08G2261/76 , C08K5/18
Abstract: This invention relates to a polybenzoxazine precursor and a method of preparing the same, and more particularly, to a polybenzoxazine precursor which includes benzoxazine obtained by reacting a phenol novolak resin with an aldehyde compound and allylamine and diaminodiphenylmethane as an amine compound, and to a method of preparing the same. The polybenzoxazine precursor may serve to prepare a hardened material having excellent thermal and electrical characteristics and dimensional stability. Accordingly, the polybenzoxazine precursor may be available for use in a copper clad laminate, a semiconductor encapsulant, a printed circuit board, an adhesive, a paint, and a mold.
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