公开(公告)号：US20180220536A1

公开(公告)日：2018-08-02

申请号：US15506035

申请日：2015-09-24

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： RALF GORDON CONRADS ,  HENDRIK HUISMAN ,  CARSTEN DEPPE ,  XI GU ,  GERO HEUSLER

IPC: H05K3/36 ,  H05K1/14 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K3/366 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/046 ,  H05K2203/049

Abstract: The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) is adapted to be coupled to a bond wire (460a, 460b) independently from the other electrically conductive layer (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) at a side surface of the printed circuit board being inclined to the top side and the bottom side of the printed circuit board. The invention further describes a corresponding method of fabricating the printed circuit board. The invention further describes a printed circuit board arrangement comprising the printed circuit board and a corresponding method of fabricating the printed circuit board arrangement.

公开(公告)号：US20160315447A1

公开(公告)日：2016-10-27

申请号：US15104599

申请日：2014-12-10

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： STEPHAN GRONENBORN ,  GERO HEUSLER ,  RALF GORDON CONRADS ,  HOLGER MOENCH

IPC: H01S5/024 ,  H01S5/022

CPC classification number: H01S5/02476 ,  H01L23/50 ,  H01L23/544 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01S5/0202 ,  H01S5/02268 ,  H01S5/02288 ,  H01S5/02469 ,  H01S5/423 ,  H01L2924/00

Abstract: The invention describes carrier structure (100, 200) for assembling a semiconductor lighting module, comprising at least two sub carriers (110, 210) and an alignment structure (120, 130, 230, 232) mechanically coupling the sub carriers (110, 210). The alignment structure (120, 130, 230, 232) is adapted such that the mechanical coupling to at least a part of the sub carriers (110, 210) disappears during thermal mating the carrier structure (100, 200) on a carrier (110, 250). The alignment structure (120, 130, 230, 232) is further adapted to compensate a coefficient of thermal expansion of a material of the carrier (110, 250) being higher than a coefficient of thermal expansion of a material of the carrier structure (100, 200). The invention further describes a semiconductor chip comprising such a carrier structure (100, 200) and a semiconductor lighting module comprising the carrier structure (100, 200) or the semiconductor chip. The invention finally describes a corresponding method of manufacturing a semiconductor lighting module. The invention enables assembling of semiconductor lighting modules by thermal mating with reduced alignment effort.

Abstract translation: 本发明描述了用于组装半导体照明模块的载体结构（100,200），其包括至少两个子载体（110,210）和对准结构（120,130,230,232），其将所述子载体（110,210） ）。 对准结构（120,130,230,232）适于使得在将载体结构（100,200）热载体配合在载体（110,210）上时，至少一部分副载体（110,210）的机械耦合消失 ，250）。 对准结构（120,130,230,232）还适于补偿载体（110,250）的材料的热膨胀系数高于载体结构材料（100）的材料的热膨胀系数 ，200）。 本发明还描述了一种包括这种载体结构（100,200）和包括载体结构（100,200）或半导体芯片的半导体照明模块的半导体芯片。 本发明最后描述了制造半导体照明模块的相应方法。 本发明能够通过热配合减少对准力来组装半导体照明模块。

公开(公告)号：US20160381732A1

公开(公告)日：2016-12-29

申请号：US15111023

申请日：2015-01-09

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： HOLGER MÖENCH ,  GUENTHER HANS DERRA ,  STEPHAN GRONENBORN ,  PAVEL PEKARSKI ,  JOHANNA SOPHIE KOLB ,  RALF GORDON CONRADS

IPC: H05B3/00 ,  H01L51/56 ,  C30B25/10 ,  C23C16/48 ,  C23C16/46 ,  C30B23/06 ,  H01L21/67 ,  H05B1/02

CPC classification number: H05B3/0047 ,  C23C16/46 ,  C23C16/481 ,  C30B23/063 ,  C30B25/105 ,  H01L21/67115 ,  H01L51/56 ,  H05B1/0233

Abstract: The invention describes a heating system (100) and a corresponding method of heating a heating surface (180) of an object (150, 950) to a processing temperature of at least 100° C., wherein the heating system (100) comprises semiconductor light sources (115), and wherein the heating system (100) is adapted to heat an area element of the heating surface (180) with at least 50 semiconductor light sources (115) at the same time. The heating system (100) may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources (115) overlaps at the heating surface (180). Differences of the characteristic of one single semiconductor light source (115) may be blurred at the heating surface (180) such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.

Abstract translation: 本发明描述了加热系统（100）和将物体（150,950）的加热表面（180）加热到至少100℃的加工温度的相应方法，其中加热系统（100）包括半导体 光源（115），并且其中所述加热系统（100）适于同时用至少50个半导体光源（115）加热所述加热表面（180）的区域元件。 加热系统（100）可以是用于处理半导体结构的反应器的一部分。 通过半导体光源（115）发射的光在加热表面（180）处重叠。 一个单个半导体光源（115）的特性的差异可能在加热表面（180）处模糊，使得跨越例如晶片的处理表面的均匀温度分布可能被实现。

公开(公告)号：US20160311230A1

公开(公告)日：2016-10-27

申请号：US15103888

申请日：2014-12-16

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： RALF GORDON CONRADS ,  STEPHAN GRONENBORN ,  GERO HEUSLER ,  HOLGER MÖENCH

IPC: B41J2/455 ,  H01S5/00 ,  B33Y30/00 ,  H01S5/42 ,  B29C67/00 ,  B33Y10/00

Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180) and a corresponding method of laser printing. The laser module comprises at least two laser arrays (110) of semiconductor lasers (115) and at least one optical element (170). The optical element (170) is adapted to image laser light emitted by the laser arrays (110), such that laser light of semiconductor lasers (115) of one laser array (110) is imaged to one pixel in a working plane (180) of the laser printing system (100) and an area element of the pixel is illuminated by means of at least two semiconductor lasers (115). The optical element does not project or focus laser light of each single semiconductor laser (115) to the working plane (180) but images the whole laser arrays to the working plane. The overlap of the laser light emitted by the semiconductor lasers (115) may improve the homogeneity of illumination or energy input and the reliability regarding malfunctions of single semiconductor lasers (115).

Abstract translation: 本发明描述了一种用于在工作平面（180）和相应的激光打印方法中照射相对于激光打印系统（100）的激光模块移动的物体的激光打印系统（100）。 激光器模块包括半导体激光器（115）和至少一个光学元件（170）的至少两个激光阵列（110）。 光学元件（170）适于对由激光阵列（110）发射的激光进行成像，使得将一个激光阵列（110）的半导体激光器（115）的激光成像到工作平面（180）中的一个像素， 的激光打印系统（100），并且通过至少两个半导体激光器（115）照亮像素的区域元件。 光学元件不将每个单个半导体激光器（115）的激光投影或聚焦到工作平面（180），而是将整个激光器阵列成像到工作平面。 由半导体激光器（115）发射的激光的重叠可以改善照明或能量输入的均匀性以及关于单个半导体激光器（115）的故障的可靠性。