公开(公告)号：US20250031355A1

公开(公告)日：2025-01-23

申请号：US18714401

申请日：2022-11-30

Applicant: KYOCERA Corporation ,  Tohoku University

Inventor： Hirotomo NISHIHARA ,  Shigeyoshi YOSHIDA ,  Ken UCHIDA

IPC: H05K9/00

Abstract: An electromagnetic interference suppressing material includes: a base material containing at least one selected from the group consisting of an organic substance and an inorganic substance; and a powder carbon material. The powder carbon material includes at least one selected from the group consisting of a first shell-shaped body and a second shell-shaped body, where the first shell-shaped body is a hollow particle having one pore or two or more pores, and the second shell-shaped body has a shape in which hollow particles are connected and has a plurality of pores, and a shell portion of the first shell-shaped body and the second shell-shaped body is made of graphene having an average number of layers of 4 or less.

公开(公告)号：US20170267859A1

公开(公告)日：2017-09-21

申请号：US15528960

申请日：2015-11-05

Applicant: KYOCERA Corporation

Inventor： Ken UCHIDA ,  Shinichi KAZAMA ,  Yoshitake TERASHI

IPC: C08L63/04 ,  H01L21/56 ,  H01L23/29

CPC classification number: C08L63/04 ,  C08L61/06 ,  C08L63/00 ,  C08L91/06 ,  C08L2203/206 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/293 ,  H01L23/31 ,  H01L2924/0002 ,  H01L2924/186 ,  H01L2924/00 ,  C08K3/04 ,  C08L61/04 ,  C08K3/36

Abstract: A resin composition for semiconductor encapsulation, containing (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) amorphous carbon, wherein the amorphous carbon of the component (D) contains 30 atomic % or more of an SP3 structure and 55 atomic % or less of an SP2 structure.

公开(公告)号：US20250071960A1

公开(公告)日：2025-02-27

申请号：US18724835

申请日：2022-12-26

Applicant: KYOCERA Corporation ,  TOHOKU UNIVERSITY

Inventor： Hirotomo NISHIHARA ,  Shigeyoshi YOSHIDA ,  Ken UCHIDA

IPC: H05K9/00 ,  H01F1/26 ,  H01F1/37

Abstract: An electromagnetic interference suppressing material includes: a base material containing at least one selected from the group consisting of an organic substance and an inorganic substance; and a carbon composite material. The carbon composite material includes at least one selected from the group consisting of a core-shell particle and a core-shell connected body, where the core-shell particle includes an inorganic particle in which a surface of the inorganic particle is coated with a coating layer composed of graphene having an average number of layers of 4 or less, and the core-shell connected body includes a connected body of inorganic particles in which a surface of the connected body of inorganic particles is coated with a coating layer of graphene having an average number of layers of 4 or less, and the electromagnetic interference suppressing material has a volume resistance of 103 Ω·cm or more.

公开(公告)号：US20230174774A1

公开(公告)日：2023-06-08

申请号：US17927686

申请日：2021-05-25

Applicant: KYOCERA CORPORATION

Inventor： Ken UCHIDA ,  Hirokazu TSURUMI

IPC: C08L63/08 ,  C08K3/04 ,  C08K3/14

CPC classification number: C08L63/08 ,  C08K3/041 ,  C08K3/14 ,  C08L2203/20 ,  C08K2201/011 ,  C08K2201/014

Abstract: Provided is a resin composition, a molded body of which is an electromagnetic wave absorber. An imaginary part (ε″) of a complex dielectric constant at 25° C. and 10 GHz and a volume resistivity (ρv) at 25° C. of the molded body satisfy the relational expression (1) below, and the imaginary part (ε″) is greater than 1.25. 20