公开(公告)号：US20110265948A1

公开(公告)日：2011-11-03

申请号：US13182465

申请日：2011-07-14

Applicant: Kazuhiro ISEBO ,  Norio SAKAI ,  Kenji KAWAKAMI ,  Nobuaki OGAWA

Inventor： Kazuhiro ISEBO ,  Norio SAKAI ,  Kenji KAWAKAMI ,  Nobuaki OGAWA

IPC: B32B37/02 ,  B32B38/14

CPC classification number: H05K3/4061 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H05K1/0306 ,  H05K3/1266 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0143 ,  H05K2203/0156 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1545 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T156/10 ,  Y10T156/109

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract translation: 通孔形成方法和多层板制造方法通过减少所需的工艺来提高制造成品率。 通孔形成方法包括：第一步骤，通过将包含导电材料并具有突出部分的调色剂颗粒附着在第一感光构件的表面上使得突出部分被引导到外部来形成调色剂图像; 以及将第一感光构件的表面相对于包含绝缘材料的生片的一个主表面并将调色剂图像转印到生片的一个主表面的第二步骤，使得调色剂颗粒的突出部分突出到 生片从而到达生片的另一个主表面和调色剂颗粒被埋在生片中。 通孔使用电子照相印刷法形成。

公开(公告)号：US20090320986A1

公开(公告)日：2009-12-31

申请号：US12559589

申请日：2009-09-15

Applicant: Kazuhiro ISEBO ,  Norio SAKAI ,  Kenji KAWAKAMI ,  Nobuaki OGAWA

Inventor： Kazuhiro ISEBO ,  Norio SAKAI ,  Kenji KAWAKAMI ,  Nobuaki OGAWA

IPC: B32B37/02 ,  G03G13/16 ,  G03G13/20

CPC classification number: H05K3/4061 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H05K1/0306 ,  H05K3/1266 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0143 ,  H05K2203/0156 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1545 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T156/10 ,  Y10T156/109

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract translation: 通孔形成方法和多层板制造方法通过减少所需的工艺来提高制造成品率。 通孔形成方法包括：第一步骤，通过将包含导电材料并具有突出部分的调色剂颗粒附着到第一感光构件的表面上以使得突出部分被引导到外部来形成调色剂图像; 以及将第一感光构件的表面相对于包含绝缘材料的生片的一个主表面并将调色剂图像转印到生片的一个主表面的第二步骤，使得调色剂颗粒的突出部分突出到 生片从而到达生片的另一个主表面和调色剂颗粒被埋在生片中。 通孔使用电子照相印刷法形成。

公开(公告)号：US20070187137A1

公开(公告)日：2007-08-16

申请号：US11738637

申请日：2007-04-23

Applicant: Kazuhiro ISEBO

Inventor： Kazuhiro ISEBO

IPC: H05K1/03

CPC classification number: H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/183 ,  H05K2201/09481 ,  H05K2201/09781 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A ceramic multilayer substrate includes a plurality of laminated ceramic layers and at least one conductor pattern and disposed on at least one of the ceramic layers. The ceramic multilayer substrate has a cavity in at least a first main surface. The ceramic multilayer substrate includes a deformation preventing pattern disposed on at least one of the ceramic layers having an opening forming the cavity. The deformation preventing pattern surrounds the entire perimeter of the opening and is made of the same material as the conductor pattern.

Abstract translation: 陶瓷多层基板包括多个层压陶瓷层和至少一个导体图案，并设置在至少一个陶瓷层上。 陶瓷多层基板在至少第一主表面中具有空腔。 陶瓷多层基板包括设置在具有形成空腔的开口的至少一个陶瓷层上的变形防止图案。 变形防止图案围绕开口的整个周边并且由与导体图案相同的材料制成。