公开(公告)号：US08337656B2

公开(公告)日：2012-12-25

申请号：US12736804

申请日：2009-05-01

Applicant: Akinori Nishio ,  Kazuyuki Kiuchi

Inventor： Akinori Nishio ,  Kazuyuki Kiuchi

IPC: B32B38/10

CPC classification number: C09J133/10 ,  C09J7/29 ,  C09J2433/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1142 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/2495

Abstract: To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend. The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C. heating, a shrink percentage in MD and a shrink percentage in TD of each 20% or more; and the pressure-sensitive adhesive layer B has a Young's modulus at 80° C. of 10 MPa or more and an adhesive strength to a silicon wafer (180-degree peel at a tensile speed of 300 mm/min) of 0.2 N/10 mm or less.

Abstract translation: 提供一种保护地面，薄而易碎的被粘物翘曲的压敏粘合片，并且可以在完成背面研磨之后从脆弱的被粘物上除去，而不损坏和污染易碎的被粘物。 粘合片5包括依次布置的基底层A，压敏粘合剂层A，基底层B和粘合剂层B，其中：基底层A具有 在25℃下的杨氏模量，其厚度为1.0×10 5〜4.0×10 5 N / m，其杨氏模量为80℃，其厚度为2.8×10 5 N / m以下的乘积。 压敏粘合剂层A在80℃下的剪切模量为0.2MPa以下; 基层B的杨氏模量为25℃，其厚度小于基底层A的厚度，并且在80℃加热下，MD的收缩率和TD的收缩百分比 每个20％以上; 并且压敏粘合剂层B在80℃下的杨氏模量为10MPa以上，对硅晶片的粘合强度（拉伸速度为300mm / min的180度剥离）为0.2N / 10 mm以下。

公开(公告)号：US20110200744A1

公开(公告)日：2011-08-18

申请号：US13093940

申请日：2011-04-26

Applicant: Takamasa HIRAYAMA ,  Kazuyuki Kiuchi ,  Masaaki Sato ,  Yukio Arimitsu ,  Daisuke Shimokawa ,  Tomoko Kishimoto

Inventor： Takamasa HIRAYAMA ,  Kazuyuki Kiuchi ,  Masaaki Sato ,  Yukio Arimitsu ,  Daisuke Shimokawa ,  Tomoko Kishimoto

IPC: B05D5/10 ,  B05D1/12

CPC classification number: H01L21/6836 ,  C08K7/22 ,  C09J7/29 ,  C09J7/385 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2205/11 ,  C09J2433/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2924/19041 ,  H01L2924/30105 ,  Y10T83/0405 ,  Y10T428/25

Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 μm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 μm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.

Abstract translation: 本发明涉及一种粘合片，其包括基材和包含热膨胀性微球的粘合层，所述粘合层设置在所述基材的至少一侧，所述粘合层的厚度为10〜38μm， 并且其中所述热膨胀性微球具有等于或小于所述粘着层的厚度的最大粒径，并且具有5至30μm的模式直径。 本发明的粘合片能够在小型陶瓷电容器等电子部件的加工工序中进行高精度加工，从而大大提高产品特性和生产率。

公开(公告)号：US20100243159A1

公开(公告)日：2010-09-30

申请号：US12743523

申请日：2008-11-17

Applicant: Akinori Nishio ,  Kazuyuki Kiuchi

Inventor： Akinori Nishio ,  Kazuyuki Kiuchi

IPC: C09J5/00 ,  B32B7/10 ,  B32B7/12

CPC classification number: B29C53/32 ,  B29C63/0013 ,  B29K2995/0049 ,  B29L2009/00 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/30 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B37/12 ,  B32B37/144 ,  B32B2038/1891 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2264/02 ,  B32B2264/101 ,  B32B2270/00 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/518 ,  B32B2307/736 ,  B32B2307/748 ,  B32B2307/75 ,  B32B2405/00 ,  B32B2457/00 ,  C09J7/29 ,  C09J2201/162 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68386 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1917 ,  Y10T156/1978 ,  Y10T428/24942 ,  Y10T428/2848

Abstract: A pressure sensitive adhesive sheet according to the present invention is a resin laminate, including a high thermally shrinkable base layer having relatively high thermal shrinkage ratio, having a ratio (A:B) of the thermal shrinkage ratio in a main shrinkage direction [A (%)] to the shrinkage ratio in a direction perpendicular to the main shrinkage direction [B (%)] of 1:1 to 10:1, and a low thermally shrinkable base layer having relatively low thermal shrinkage ratio, the high and low thermally shrinkable base layers bonded to each other via a self-adhesive layer, wherein the resin laminate bends toward the high thermally shrinkable base layer side when heated from any one direction and can automatically curl from one terminal unidirectionally to form a tubular roll by further heating. The pressure sensitive adhesive sheet can be separated from an adherend smoothly when heated from any one direction. Thus, it can be used, for example, as a pressure sensitive adhesive sheet for semiconductor wafer polishing.

Abstract translation: 根据本发明的压敏粘合片是具有热收缩率相对较高的热收缩性高的基层，其主收缩方向的热收缩率的比（A:B）为[A（B） ％）]相对于主收缩方向[B（％）]垂直的方向的收缩率为1:1〜10:1，热收缩率比较低的热收缩性低的基底层，高，低热收缩率 通过自粘合层彼此粘合的可收缩的基底层，其中当从任何一个方向加热时，树脂层压板朝向高热收缩基底层弯曲，并且可以通过进一步加热自动地从一个端子卷曲形成管状辊。 当从任何一个方向加热时，压敏粘合片可以平滑地与被粘物分离。 因此，其可以用作例如半导体晶片研磨用压敏粘合片。

公开(公告)号：US20100028588A1

公开(公告)日：2010-02-04

申请号：US12311974

申请日：2007-10-18

Applicant: Kazuyuki Kiuchi

Inventor： Kazuyuki Kiuchi

IPC: C09J7/02 ,  C09J11/00 ,  C09J201/00 ,  B32B38/10

CPC classification number: H01L21/6836 ,  C08K9/10 ,  C09J5/06 ,  C09J7/29 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2205/302 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2924/19041 ,  Y10T428/1495 ,  Y10T428/24372 ,  Y10T428/2495

Abstract: To provide a heat-peelable pressure-sensitive adhesive sheet which, even when applied to a flexible adherend or extremely small adherend, enables the adherend to be efficiently peeled and recovered therefrom without breakage.The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and arranged on one side thereof in the following order, an intermediate layer having a thickness “A”, and a heat-peelable pressure-sensitive adhesive layer having a thickness “B” and containing heat-expandable microspheres with a largest particle diameter “C”. The parameters A, B, and C satisfy the following conditions: C≦(A+B)≦60 (μm) and 0.25C≦B≦0.8C, and the heat-peelable pressure-sensitive-adhesive layer, when subjected to a heating treatment, shows an adhesive strength of less than 0.1 N/20 mm after the heating treatment. The heat-peelable pressure-sensitive adhesive layer after the heating treatment preferably has an arithmetic mean surface roughness Ra of 5 μm or smaller and a maximum height of the profile Rmax of 25 μm or smaller. The substrate preferably has a glass transition temperature (Tg) of 60° C. or higher and a thickness of 50 μm or smaller.

Abstract translation: 为了提供一种即使应用于柔性被粘物或非常小的被粘物也能够有效地剥离被剥离并且不被破坏的被剥离体的热剥离性粘合片。 可热剥离性粘合片包括基板，按照以下顺序设置有厚度“A”的中间层和厚度“B”的热剥离性粘合剂层， 并含有最大粒径“C”的热膨胀性微球。 参数A，B和C满足以下条件：C <=（A + B）<= 60（母）和0.25℃<= B <= 0.8℃，并且可热剥离的压敏粘合剂层， 当进行加热处理时，在加热处理后显示小于0.1N / 20mm的粘合强度。 加热处理后的热剥离性粘合剂层的算术平均表面粗糙度Ra优选为5μm以下，轮廓Rmax的最大高度为25μm以下。 基板的玻璃化转变温度（Tg）优选为60℃以上，厚度为50μm以下。

公开(公告)号：US08502397B2

公开(公告)日：2013-08-06

申请号：US12970282

申请日：2010-12-16

Applicant: Yuichiro Yanagi ,  Kazuyuki Kiuchi ,  Shinji Hoshino

Inventor： Yuichiro Yanagi ,  Kazuyuki Kiuchi ,  Shinji Hoshino

IPC: H01L23/28

CPC classification number: H01L21/568 ,  C09J7/20 ,  C09J2203/326 ,  C09J2421/00 ,  C09J2463/00 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T428/287 ,  H01L2924/00

Abstract: The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.

Abstract translation: 本发明提供了一种用于半导体器件制造的耐热粘合片，当芯片被树脂封装时，该耐热粘合片被附着到无基底半导体芯片上。 粘合片包括基材层和粘合剂层。 粘合层含有橡胶成分和环氧树脂成分。 粘合剂中的有机物质中的橡胶成分的比例为20〜60重量％。

公开(公告)号：US20110067808A1

公开(公告)日：2011-03-24

申请号：US12736804

申请日：2009-05-01

Applicant: Akinori Nishio ,  Kazuyuki Kiuchi

Inventor： Akinori Nishio ,  Kazuyuki Kiuchi

IPC: B32B38/10 ,  C09J7/02 ,  B32B27/30

CPC classification number: C09J133/10 ,  C09J7/29 ,  C09J2433/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1142 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/2495

Abstract: To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend.The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C. heating, a shrink percentage in MD and a shrink percentage in TD of each 20% or more; and the pressure-sensitive adhesive layer B has a Young's modulus at 80° C. of 10 MPa or more and an adhesive strength to a silicon wafer (180-degree peel at a tensile speed of 300 mm/min) of 0.2 N/10 mm or less.

Abstract translation: 提供一种保护地面，薄而脆弱的被粘物从“翘曲”的压敏粘合片，并且可以在完成背面研磨之后从脆弱的被粘物上去除而不损坏和污染易碎的被粘物。 粘合片5包括依次布置的基底层A，粘合剂层A，基底层B和压敏粘合剂层B，其中：基底层A具有 在25℃下的杨氏模量，其厚度为1.0×10 5〜4.0×10 5 N / m，其杨氏模量为80℃，其厚度为2.8×10 5 N / m以下的乘积。 压敏粘合剂层A在80℃下的剪切模量为0.2MPa以下; 基层B的杨氏模量为25℃，其厚度小于基底层A的厚度，并且在80℃加热下，MD的收缩率和TD的收缩百分比 每个20％以上; 并且压敏粘合剂层B在80℃下的杨氏模量为10MPa以上，对硅晶片的粘合强度（拉伸速度为300mm / min的180度剥离）为0.2N / 10 mm以下。

公开(公告)号：US07514143B2

公开(公告)日：2009-04-07

申请号：US10912615

申请日：2004-08-05

Applicant: Takeshi Matsumura ,  Kouji Akazawa ,  Kazuyuki Kiuchi ,  Tomokazu Takahashi

Inventor： Takeshi Matsumura ,  Kouji Akazawa ,  Kazuyuki Kiuchi ,  Tomokazu Takahashi

IPC: B32B7/12 ,  B05D5/10

CPC classification number: C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  Y10T156/1052 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/28 ,  Y10T428/2848

Abstract: The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive layer, the intermediate layer having a storage elastic modulus (G′) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G′) of 1.0×103 to 8.0×104 Pa at 200° C.

Abstract translation: 本发明的可再剥离粘合片是一种可再剥离的压敏粘合片，其包括在基膜上形成的粘合层，并且还包括在基膜和粘合剂之间的至少一个中间层 层，中间层在23℃下的储能弹性模量（G'）为3.0×10 4〜1.0×10 8 Pa，在200℃下的储能弹性模量（G'）为1.0×10 3〜8.0×10 4 Pa。

公开(公告)号：US20070111392A1

公开(公告)日：2007-05-17

申请号：US11650449

申请日：2007-01-08

Applicant: Akihisa Murata ,  Toshiyuki Oshima ,  Yukio Arimitsu ,  Kazuyuki Kiuchi ,  Masaaki Sato ,  Michirou Kawanishi

Inventor： Akihisa Murata ,  Toshiyuki Oshima ,  Yukio Arimitsu ,  Kazuyuki Kiuchi ,  Masaaki Sato ,  Michirou Kawanishi

IPC: H01L21/00

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/11 ,  H01L2221/68327 ,  H01L2924/19041 ,  Y10T428/28

Abstract: A method of overheating and releasing a chip cut piece from a thermal release type pressure sensitive adhesive sheet is a method by which a chip cut piece stuck onto a thermal release type pressure sensitive adhesive sheet having a base material, and a thermally expandable microsphere-containing thermally expandable pressure sensitive adhesive layer provided on a surface of the base material is thermally released from the thermal release type pressure sensitive adhesive sheet and which is characterized by including the step of overheating while restraining the overheat and release type pressure sensitive adhesive sheet to thereby release the chip cut piece. A means for restraining the thermal release type pressure sensitive adhesive sheet may be an absorption means using suction or may be a bonding means using an adhesive agent. In this manner, the chip cut piece can be thermally released from the overheat and release type pressure sensitive adhesive sheet while position displacement in a horizontal direction can be prevented.

Abstract translation: 从热脱模型压敏粘合片过热释放切屑的方法是将切屑粘贴到具有基材的热释放型压敏粘合片和含有热膨胀性微球的热释放型微球的方法 设置在基材表​​面上的可热膨胀的压敏粘合剂层从热释放型压敏粘合片热释放，其特征在于包括过热的步骤，同时限制过热和释放型压敏粘合片从而释放 切片切片。 用于抑制热释放型压敏粘合片的装置可以是使用吸附的吸收装置，或者可以是使用粘合剂的粘合装置。 以这种方式，切屑切片可以从过热和释放型压敏粘合片热释放，同时可以防止在水平方向上的位置偏移。

公开(公告)号：US06998175B2

公开(公告)日：2006-02-14

申请号：US09853787

申请日：2001-05-14

Applicant: Akihisa Murata ,  Toshiyuki Oshima ,  Yukio Arimitsu ,  Kazuyuki Kiuchi

Inventor： Akihisa Murata ,  Toshiyuki Oshima ,  Yukio Arimitsu ,  Kazuyuki Kiuchi

IPC: C09J7/02 ,  B32B27/00

CPC classification number: C09J7/22 ,  C09J7/38 ,  C09J2205/11 ,  Y10S428/922 ,  Y10T428/14 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2878 ,  Y10T428/2891

Abstract: A heat-peelable pressure-sensitive adhesive sheet which, even when used for temporarily fixing electronic parts having poor resistance to static electricity, such as magnetic heads, is effective in preventing the yield of such electronic parts from being reduced by electrostatic breakage, while ensuring its functions of adhesiveness before heating and peelability after heating. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 1012 Ω/□ or lower. In this heat-peelable pressure-sensitive adhesive sheet, the heat-expandable pressure-sensitive adhesive layer before heating may have a center line average surface roughness of 2 μm or less and a maximum surface roughness of 5 μm or less. The adhesive sheet may have a rubber-like organic elastic layer interposed between the substrate and the heat-expandable pressure-sensitive adhesive layer.

Abstract translation: 即使用于临时固定耐静电性差的电子部件（例如磁头）的热剥离性粘合片也能有效地防止这种电子部件的收率因静电破坏而减少，同时确保 其加热前的粘合性和加热后的剥离性的功能。 热剥离性粘合片包括基材，在其至少一面形成有含有热膨胀性微球的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂层的表面电阻率 10 12Ω/□以下。 在该热剥离性粘合片中，加热前的热膨胀性压敏粘合剂层的中心线平均表面粗糙度可以为2μm以下，最大表面粗糙度为5μm以下。 粘合片可以具有插入在基板和热膨胀性压敏粘合剂层之间的橡胶状有机弹性层。

公开(公告)号：US06488803B2

公开(公告)日：2002-12-03

申请号：US09782037

申请日：2001-02-14

Applicant: Kazuyuki Kiuchi ,  Toshiyuki Oshima ,  Akihisa Murata ,  Yukio Arimitsu

Inventor： Kazuyuki Kiuchi ,  Toshiyuki Oshima ,  Akihisa Murata ,  Yukio Arimitsu

IPC: B32B712

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/11 ,  C09J2433/00 ,  H01L2221/68327 ,  H01L2924/19041 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2887

Abstract: A radiation-curable heat-peelable pressure-sensitive adhesive sheet is disclosed which has tackiness enabling adherends to withstand transportation and other steps, with which cutting can be conducted without flinging up an adhesive waste or causing chipping, and from which the cut pieces can be easily separated and recovered. The radiation-curable heat-peelable pressure-sensitive adhesive sheet comprises a substrate and, formed on at least one side thereof, a pressure-sensitive adhesive layer containing heat-expandable microspheres and a radiation-curable compound. A work to be cut is placed on the surface of the pressure-sensitive adhesive layer of the radiation-curable heat-peelable pressure-sensitive adhesive sheet, and the pressure-sensitive adhesive layer is irradiated with a radiation to cure the adhesive layer. The work is cut into pieces and the pressure-sensitive adhesive layer is then thermally foamed, before the cut pieces are separated and recovered from the adhesive sheet. Thus, cut pieces can be efficiently produced without arousing troubles in processing steps.

Abstract translation: 公开了一种可辐射固化的可热剥离的压敏粘合片，其具有使被粘物能够承受运输等步骤的粘性，通过该步骤可以进行切割，而不会使粘合剂废料卷起或引起碎裂，并且切割片可以从其 容易分离和回收。 可辐射固化的可热剥离的压敏粘合片包括基底，并且在其至少一个侧面上形成含有热膨胀性微球体和可辐射固化化合物的压敏粘合剂层。 将待切割的工件放置在可辐射固化的可热剥离的压敏粘合片的压敏粘合剂层的表面上，并用辐射照射粘合剂层以固化粘合剂层。 在将切割片从粘合片分离并回收之前，将工件切成块，然后将压敏粘合剂层热发泡。 因此，可以有效地生产切片，而不会在加工步骤中引起麻烦。