公开(公告)号：US10049801B2

公开(公告)日：2018-08-14

申请号：US14885953

申请日：2015-10-16

Applicant: Keyssa Licensing, Inc.

Inventor： Stephen Robert Venuti ,  Steve Novak

IPC: H05K1/18 ,  H01F7/02 ,  H05K7/00 ,  H05K1/14 ,  F23Q3/00 ,  H01F13/00

Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.

公开(公告)号：US20180330859A1

公开(公告)日：2018-11-15

申请号：US16043053

申请日：2018-07-23

Applicant: Keyssa Licensing, Inc.

Inventor： Stephen Robert Venuti ,  Steve Novak

IPC: H01F7/02 ,  H05K1/18

CPC classification number: H01F7/0242 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/0707 ,  H05K2201/10098 ,  H05K2203/104 ,  H05K2203/166 ,  Y02P70/611

Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.

公开(公告)号：US20170110229A1

公开(公告)日：2017-04-20

申请号：US14885953

申请日：2015-10-16

Applicant: Keyssa Licensing, Inc.

Inventor： Stephen Robert Venuti ,  Steve Novak

IPC: H01F7/02 ,  H05K1/18

CPC classification number: H01F7/0242 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/0707 ,  H05K2201/10098 ,  H05K2203/104 ,  H05K2203/166 ,  Y02P70/611

Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.