Panelizing Method for Printed Circuit Board Manufacturing
    1.
    发明申请
    Panelizing Method for Printed Circuit Board Manufacturing 审中-公开
    印刷电路板制造的面板化方法

    公开(公告)号:US20100263207A1

    公开(公告)日:2010-10-21

    申请号:US12743843

    申请日:2008-11-25

    Applicant: Kimmo Paananen

    Inventor: Kimmo Paananen

    Abstract: The invention relates to a method for connecting at least two printed circuit board modules to form a printed circuit board panel by means of a virtual panel. The method for connecting printed circuit board modules uses positioning tags and counterparts thereof, which align the printed circuit board modules to a target location on the printed circuit board panel.

    Abstract translation: 本发明涉及一种用于连接至少两个印刷电路板模块以通过虚拟面板形成印刷电路板面板的方法。 用于连接印刷电路板模块的方法使用定位标签及其对应物,其将印刷电路板模块对准印刷电路板面板上的目标位置。

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