公开(公告)号：US20210320049A1

公开(公告)日：2021-10-14

申请号：US17011755

申请日：2020-09-03

Applicant: KIOXIA CORPORATION

Inventor： Daigo SUZUKI ,  Kosuke AWAGA

IPC: H01L23/433 ,  H01L25/18 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K5/00 ,  H05K7/20

Abstract: A semiconductor storage device includes a housing, an interface substrate attached to the housing, an insulating substrate in the housing, a first flexible substrate connecting the insulating substrate and the interface substrate, a first integrated circuit on a first surface of the insulating substrate, and a first heat conductor arranged on a second surface of the insulating substrate that is opposite to the first surface, and contacting a first inner surface of the housing.

公开(公告)号：US20240046965A1

公开(公告)日：2024-02-08

申请号：US18365718

申请日：2023-08-04

Applicant: Kioxia Corporation

Inventor： Kosuke AWAGA

IPC: G11B33/14 ,  H05K1/02

CPC classification number: G11B33/142 ,  H05K1/0203 ,  H05K2201/10416

Abstract: A semiconductor storage device has a substrate, a semiconductor chip, a capacitor, and a heatsink. The semiconductor chip is mounted on the substrate. The capacitor is mounted on the substrate and overlaps with the semiconductor chip in a thickness direction of the substrate. The heatsink has fins and the capacitor is mounted in the heatsink.